Several iNEMI projects are addressing challenges related to miniaturization, all with the goal of maximizing product value in the smallest possible form factor.
Our proactive, member-driven environmental projects focus on closing technology gaps while attacking problems with scientific depth and rigor to develop sustainable solutions.
A team of iNEMI member companies has been investigating possible projects related to counterfeit components. The team has finalized the project definition and developed a Statement of Work (SOW), which has been approved the iNEMI Technical Committee (TC). Open enrollment period began in December and will run through January 31, 2012.
The Structural Test of External Memory Devices Project (Boundary Scan Adoption, Phase 2) has addended their Statement of Work (SOW) to include testing of DDR memory. Members who have not been participants in the Boundary Scan Project can get involved for the DDR memory testing. Existing project participants are not required to do anything. New participants must download, sign and return the original Project Statement by February 17, 2012.
Part of iNEMI's planning methodology is to develop a 10-year research vision to help focus limited R&D resources in order to ensure development of the innovative technologies required to maintain the growth of the electronics industry.
iNEMI and ISMI (International SEMATECH Manufacturing Initiative) are organizing a new, exploratory effort to standardize semiconductor packaging equipment. The objective is to converge pre-competitive packaging equipment requirements in areas that will mutually benefit IC makers and equipment suppliers.
