iNEMI

... is an industry-led consortium of approximately 70 electronics manufacturers, suppliers and related organizations.

Our mission: to identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure. Accelerated deployment of technology is shaped and led by our members, and provides benefits to the global electronics industry.

Order the 2009 iNEMI Roadmap


Member Information

 

Latest News

2009 Roadmap Now Available

iNEMI Members Release Position Statement on the Definition of “Low Halogen” for Electronic Products (07/01/09)

iNEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09)

Sign up for Characterization of Pb-Free Alloy Alternatives Project (sign-up period ends July 24)

Sign up for Eco-Impact Evaluator for ICT Equipment Project (sign-up period ends July 27)

Sign up for HFR-Free PCB Materials and HFR-Free Signal Integrity Projects (initial sign-up ends June 29)

Congratulations to the boundary scan book winners.  Click here for details.

Presentation:  Closing Technology Knowledge Gaps - Projects Arising from the iNEMI Technology Roadmap, presented by Grace O'Malley (iNEMI) at EMPC 2009, Session:  IMAPS Global Business Council (6/18/09; Rimini, Italy)

Presentation:  Addressing Opportunities and Risks of Pb-Free Solder Alloy Alternatives, presented by Grace O'Malley (iNEMI) at EMPC 2009, Session: Materials: Solder Joint Properties and Reliability I (6/16/09; Rimini, Italy)

  Presentation:  End-of-project webinar for the iNEMI Tin Whisker Accelerated Test Project (Phases 1-5) (6/10/09)

  iNEMI Member Newsletter (June 2009)

Presentation:  iNEMI 2009 Roadmap Keynote; Astride the Packaging Roadmap seminar, held at TWI Ltd (4/22/09; Cambridge, United Kingdom)

Presentation:  Conversion to Non-Halogenated Flame Retardants in Electronics, NEPCON Shanghai (4/22/09; Shanghai, China)

Presentations:  iNEMI 2009 Roadmap Keynote and Chapter Discussions, SMTA China East Technical Conference (4/21/09; Shanghai, China)

Presentations:  HFR-Free Leadership Meeting (4/15/09; Taipei, Taiwan)

Presentation:  iNEMI HFR-Free Leadership Program Meeting (4/1/09; APEX, Las Vegas, Nevada)

Presentations:  iNEMI Pb-Free Forum (4/2/09; APEX Free Forum FF06; Las Vegas, Nevada)

Presentations:  iNEMI Technology Roadmap (3/31/09; APEX Free Forum FF02; Las Vegas, Nevada)

Presentations:  Fiber Connector End-Face Inspection Project and Optoelectronics TIG Meetings, OFC/NFOEC 2009 Conference (3/23/09; San Diego, CA)

2009 iNEMI Roadmap is Now Available to Industry (4/1/09)

iNEMI Organizes New Program to Support Supply Chain Conversion to HFR-Free PCBs (3/31/09)

iNEMI Provides Industry Leadership on Environment (01/08/09)

iNEMI 2008 Annual Report
 

Upcoming Events

Teleconferences/Webinars

Teleconference:  Eco-Impact Evaluator for ICT Equipment Project (July 7)

Teleconference:  PVC Alternatives Initiative (July 9)

Teleconference:  Characterization of Pb-Free Alloy Alternatives Project (July 21)

  End-of-Project Webinar:  iNEMI Lead-Free Rework Optimization (Phases 1 and 2) (August 5)


United States

iNEMI Medical Reliability for MLCCs Project Meeting, hosted by Texas Instruments (July 21; Dallas, Texas)

SMTAI 2009 - SMTA International Electronics Exhibition 2009 (October 4-8; San Diego, California)


Asia

ICEPT-HDP 2009 (August 10-13; Beijing, China)

NEPCON China (August 31 - September 2; Shenzhen, China)


New Initiatives

HFR-Free Leadership
   - PCB Material
   - Signal Integrity

Characterization of Pb-Free Alloy Alternatives

PVC Alternatives

Eco-Impact Evaluator for ICT Equipment

Board Coplanarity in SMT Project

Board Flexure Standardization Project

Boundary Scan Adoption Project

BFR-Free High-Reliability PCB

Medical Reliability for MLCCs (Multi-Layer Ceramic Capacitors) Project

Pb-Free Component and Board Finish Reliability

Solder Paste Deposition Project

Hot Topics

iNEMI Roadmap


Lead-free & environmental


RoHS & WEEE


Tin whiskers


iNEMI Members