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iNEMI Roadmap Newsletter (July 2010)
iNEMI Environmental Newsletter (July 2010)
 iNEMI Member Newsletter (July 2010)
End-of-Project Webinar: Built-In Self-Test (BIST) (July 14)
iNEMI Workshop Will Focus on Role of Electronics Industry in Development of Alternative Energies
Mark Kaltenbach named iNEMI consultant for project management
Click here for OEM/ODM Assistance Request for Dynamic Warpage of your PCBs
iNEMI Adds Consultant in Japan
iNEMIが日本にコンサルタントを採用
Presentations: iNEMI Council Meeting (04/13/10; Las Vegas, Nevada)
Presentations: iNEMI Test TIG Meetings (04/08/10; Las Vegas, Nevada)
Bill Bader interview with iConnect at APEX (04/07/10; Las Vegas, Nevada)
iNEMI Organizes Four New Packaging Initiatives
iNEMI Adds 10 New Members in First Quarter of 2010
End-of-Project Webinar: iNEMI Medical Reliability for MLCCs (Multi-Layer Ceramic Capacitors) Project (03/31/10)
iNEMI Position on Product Carbon Footprinting
The Evolving Direction for Environmental Programs in the Electronics Industry, presented by Bob Pfahl (iNEMI) at the Systems Packaging Japan Workshop 2010; Kyoto, Japan (01/25/10)
End-of-Project Webinar: Board Flexure Standardization Project (01/20/10)
Webinar: Highlights from the 2009 iNEMI Environmentally Conscious Electronics Roadmap (12/15/09)
Organic Packaging Substrates Workshop - New Initiatives
Videos: iNEMI Environmental Leadership Forum; San Diego, California (10/08/09)
2009 Research Priorities Now Available
2009 Technical Plan Now Available
iNEMI Recognizes Tetsuro Nishimura for Nihon Superior’s Extraordinary Support of iNEMI Activities (11/05/09)
Presentations: iNEMI Board & Systems Manufacturing Test TIG Meetings, held at International Test Conference; Austin, Texas (11/05/09)
Presentations: Symposium on Global ICT Environmental Initiatives, sponsored by iNEMI and Intel; Brussels, Belgium (October 27-28, 2009)
Presentations: iNEMI Meetings in Asia (October 2009)
Presentations: iNEMI at IMPACT 2009; Taipei, Taiwan (October 2009)
End-of-Project Webinar: Boundary Scan Adoption Project (10/20/09)
End-of-Project Webinar: Boundary Scan Adoption Project (10/20/09)
Presentations: iNEMI Meetings at SMTAI (October 2009; San Diego, California)
Bill Bader Joins iNEMI as CEO
Bill Bader先生新任iNEMI首席执行官
End-of-Project Webinar - iNEMI Functional Test Coverage Assessment Project (08/12/09)
End-of-Project Webinar - iNEMI Lead-Free Rework Optimization, Phases 1 and 2 (08/05/09)
iNEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09) |
Teleconferences/Webinars
Teleconferences: iNEMI Packaging Substrates TIG (July 27-30)
Teleconference: Copper Wire Bonding (US: August 5; Asia: August 6)
United States
iNEMI-Purdue-NSF Sustainable Electronics Workshop (date TBD; West Lafayette, Indiana)
iNEMI Alternative Energy Workshop (October 20-21; San Jose, California)
Europe
iNEMI Medical Packaging Workshop (September 16-17; Berlin, Germany)
Sign Up for New Projects
iNEMI Structural Test of External Memory Devices Project (Boundary Scan Adoption, Phase 2)
Organic Packaging Substrates
- Warpage
- Miniaturization
- Holistic Approach to Packaging
Creep Corrosion
Built-In Self-Test (BIST)
Characterization of Pb-Free Alloy Alternatives
PVC Alternatives
HFR-Free Leadership
- PCB Material
- Signal Integrity
Eco-Impact Evaluator for ICT Equipment
Board Coplanarity in SMT Project
Board Flexure Standardization Project
Pb-Free Component and Board Finish Reliability
Solder Paste Deposition Project
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