Members

• 3M
• AeA
• Agile Software Corporation
• Agilent Technologies, Inc.
• Albemarle Corporation
• Alcatel-Lucent
• AMR Research, Inc.
• Boston Scientific CRM
• CBA Group LLC
        o  Hover-Davis
        o  Universal Instruments
        o  Vitronics Soltec  
        o  Unovis Solutions
• Celestica, Inc.
• Center for Innovative Technology (CIT)
• Ciba Corporation
• Cisco Systems, Inc.
• Linksys
• Scientific Atlanta, Inc.
• Cookson Electronics
  • Alpha
  • Enthone
  • Cookson Electronics - Semiconductor Products
• Dassault Systemes - ENOVIA MatrixOne
• Delphi Electronics & Safety
• DYCONEX AG
• E2open
• Electronic Components, Assemblies & Materials Association (ECA)
• Endicott Interconnect Technologies, Inc. (EIT)
• ERSA North America
• Flextronics International
• Foxconn
• Georgia Institute of Technology
• Henkel
• Hewlett-Packard Company
• Huawei Technologies Co., Ltd.
• IHS
• Indium Corporation of America
• Industrial Technology Research Institute (ITRI)
• Integrated Electronics Engineering Center (IEEC), SUNY-Binghamton
• Intel Corporation
• IPC-Association Connecting Electronics Industries
• Jabil Circuit, Inc.
• Kester
• MED-EL Elektromedizinische Gerte GmbH
• Micro Systems Engineering, Inc.
• Ministre du Developpement conomique, de l'Innovation et de l'Exportation (Province of Quebec)
• Motorola, Inc.
• NanoDynamics, Inc.
• Nan Ya Plastics Corporation
• National Center for Manufacturing Sciences (NCMS)
• National Institute of Standards and Technology (NIST)
• Nihon Superior Co., Ltd.
• Plexus Corp.
• Purdue University
• Rambo Chemicals (HK) Ltd.
• Rohm and Haas Electronic Materials
• Sanmina-SCI Corporation
• Senju Comtek Corp. (SCC)
• Siemens Product Lifecycle Management Software, Inc.
• Speedline Technologies, Inc.
• STATS ChipPAC
• Sun Microsystems, Inc.
• Teradyne, Inc.
• Test Research, Inc.
• Texas Instruments Incorporated
• Tyco Electronics Corporation