Organization
- AeA
- Agilent Technologies, Inc.
- Albemarle Corporation
- Alcatel-Lucent
- AMR Research, Inc.
- ASSET InterTech, Inc.
- Boston Scientific CRM
- CBA Group LLC
o Hover-Davis o Universal Instruments o Unovis Solutions
- Celestica, Inc.
- Center for Innovative Technology (CIT)
- Cisco Systems, Inc.
- Cookson Electronics
- Corelis
- Dell, Inc.
- Delphi Electronics & Safety
- Doosan Corp. Electro-Materials BG
- Electronic Components, Assemblies & Materials Association (ECA)
- Elite Material Co., Ltd.
- Endicott Interconnect Technologies, Inc. (EIT)
- Flextronics International
- Foxconn
- Georgia Institute of Technology
- Guangdong Shengyi Sci. Tech Co., Ltd.
- Henkel
- Hewlett-Packard Company
- Huawei Technologies Co., Ltd.
- IBIDEN CO., LTD.
- IHS
- Indium Corporation of America
- Illinois Tool Works
- Industrial Technology Research Institute (ITRI)
- Integrated Electronics Engineering Center (IEEC), SUNY-Binghamton
- Intel Corporation
- IPC-Association Connecting Electronics Industries
- IST-Integrated Service Technology, Inc.
- ITEQ Corporation
- Lenovo
- MED-EL Elektromedizinische Gerte GmbH
- Micro Systems Technologies Management GmbH
- NanoDynamics, Inc.
- Nan Ya Plastics Corporation
- National Center for Manufacturing Sciences (NCMS)
- National Institute of Standards and Technology (NIST)
- Nihon Superior Co., Ltd.
- Plexus Corp.
- Purdue University
- Quanta Computer Inc.
- Rambo Chemicals (HK) Ltd.
- Rohm and Haas (a wholly owned subsidiary of The Dow Chemical Company)
- Sanmina-SCI Corporation
- Senju Comtek Corp. (SCC)
- STATS ChipPAC
- Sun Microsystems, Inc.
- Teradyne, Inc.
- Test Research, Inc.
- Texas Instruments Incorporated
- Tyco Electronics Corporation
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