Calendar
Tuesday, May 30, 2006; 8:30 a.m. - 5:00 p.m.
Sheraton San Diego; San Diego, California
Sponsored by iNEMI, ECTC and CPMT
Chair: R.W. Gedney, iNEMI; Co-Chair: M.E.Williams, NIST
Moderator: H. Leidecker, NASA
Preliminary Agenda
Abstracts
The electronics industry has been aware of tin whiskers for 50 years, and many mitigation strategies have been used to prevent whiskers, thus assuring reliability in electronic assemblies. Most of these strategies involved the addition of lead to the tin coating, and as the industry moves to Pb-free assemblies, tin whiskers are again a concern. iNEMI has been studying this problem for several years.
This workshop will review the results of the latest series of iNEMI experiments for tin whiskers. Tin whisker theory will also be updated with the latest thinking on how tin whiskers are formed. Techniques for mitigating tin whiskers, quality control and manufacturing impact will be discussed. In addition, a roundtable discussion featuring suppliers and end users will provide insight into the intent and recommended implementation of new JEDEC/IPC specifications that address tin whiskers (JP 002, Current Tin Whisker Theory and Mitigation Practices Guideline; JESD 201, Environmental Acceptance Requirements For Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes; and JESD22-A121, Tin Whisker Test Method). The goal is to help industry develop strategies for eliminating — or at least controlling — tin whiskers in order to assure reliability in long life cycle applications.
Workshop registration
This workshop is part of ECTC, and registration is being handled through ECTC, and participants must register for at least one day of the conference in addition to registering for the workshop. Click here for online registration.
Click here for additional details about ECTC 2006.
Download ECTC advance program.
Preliminary Agenda