Click here to register
Meeting Overview
Identify areas where development is required for mission critical applications to convert to Pb-free with acceptable risks in terms of manufacturing and reliability.
Situation Analysis
For companies that participate in industries that require high-reliability/long-service-life products, the rationale for staying with SnPb assembly for the short to mid term is very clear: in many cases Pb-free technology has not been able to demonstrate the required level of reliable performance for long-life, mission-critical applications. While it is increasingly obvious that virtually all electronics products will be Pb-free over time, there are a number of knowledge gaps that must be closed before Pb-free reliability can be predicted with the same certainty that SnPb assembly can deliver. The risks and potential long-term costs associated with this uncertainty to users and producers of these products are too great to ignore.
Objectives
The meeting objectives are to:
- Review strategy and progress of iNEMI’s high reliability task group related to Pb-free conversion
- Discuss results of efforts to encourage availability of SnPb compatible BGAs
- Review identified knowledge gaps for high reliability Pb-free conversion
- Review progress to date on collaboration to close gaps
- Identify opportunities for increasing European involvement in these member projects
Who should attend
- Industrial Technical Managers responsible for Pb-free technology at high reliability firms
- Engineers interested in learning about the identified high rel. knowledge gaps and the efforts to close them
- Marketing and Technology Managers from EMS and supplier firms that support high reliability segments
Preliminary Agenda