Calendar
This is an invitation to participate in or lead one of the new initiatives proposed from the iNEMI Organic Packaging Substrates Workshop in Nagoya, Japan in November 2009. Six areas for potential industry collaborative initiatives were identified at the workshop.
New Initiative Opportunities (PDF)
Statement of Work Guidelines (PDF)
Please click on the link for each initiative to get the teleconferencing information.
1. Warpage Qualification Criteria (Substrates, Package and Board Levels)
North America: Tuesdays, March 9
4:00 pm PST, 7:00 pm EST
Asia: Wednesdays, March 10
8:00 am China
2. Identification of Primary Factors of Warpage
North America: Tuesdays, March 9
5:30 pm PST, 8:30 pm EST
Asia: Wednesdays, March 10
9:30 am China
3. Wiring Density Program
North America: Wednesdays, March 10
4:00 pm PST, 7:00 pm EST
Asia: Thursdays, March 11
8:00 am China
1) Materials
2) Lithography
3) Plating
4) Inspection and Test
4. Holistic Modeling Process
North America: Wednesdays, March 10
1:00 pm PST, 4:00 pm EST
Asia: Thursdays, March 11
5:00 am China
5. Optimization of Time to Yield (Design, Materials, Packaging)
North America: Thursdays, March 11
2:00 pm PST, 5:00 PM EST
Asia: Fridays, March 12
6:00 am China
6. Reliability Methodology for Substrates
North America: Thursdays, March 11
4:00 pm PST, 7:00 PM EST
Asia: Fridays, March 12
8:00 am China
Anyone in the industry is welcome to join the Project Formation Teams in defining the elements, tasks and project timelines for each of these areas.
If you have any questions, please contact:
Jim Arnold (North America)
Tel: +1 480-854-0906
Mobile: +1 480-703-0133
jim.arnold@inemi.org
Haley Fu (Asia)
+86 21 5835 3839
haley.fu@inemi.org