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Tin Whisker Workshop
Tuesday, May 29, 2007
Sponsored by iNEMI, ECTC and CPMT as part of the
Electronic Components and Technology Conference (ECTC)
Reno, NV
Tin plating has been, and continues to be, the preferred surface coating for the leads on electronic components. However, tin-based plating can be susceptible to the formation of needle-like protrusions, or whiskers, a concern for many applications, especially those concerned with high reliability and long useful life.
This workshop will provide:
- Practical data on the effects of temperature and humidity on whisker formation
- Extensive industry data collected over several years in manufacturing
- Impact of substrate materials on intermetallic formation
- Stress in tin film and its relationship to whisker growth
- Methodologies for measuring stress
- Recommendations for mitigation practices, including coatings
- Progress toward a unified theory for whisker formation
Break-out sessions are planned giving the audience the ability to discuss specific topics with experts in the field.
Draft Agenda (PDF)