Preliminary Agenda

Registration

Background
Since 1994, iNEMI (the International Electronics Manufacturing Initiative) has been developing a biennial technology roadmap spanning a 10-year horizon.  In 2004, iNEMI expanded the initiative to proactively include global input.  This meeting is one of several regional meetings intended to solicit input for the 2007 iNEMI Roadmap.  Meetings are also being held in Europe and Asia.

Objectives
The purpose of this meeting is to:
     � Discuss draft roadmap chapters for primary technology and infrastructure areas. 
     � Obtain industry input to these draft chapters.
     � Ensure inclusion of key North American issues in the 2007 Roadmap.

Intended audience
     � Representatives from industry, institutes and government interested in obtaining a preliminary view of the 2007 Roadmap.
     � Electronics industry leaders willing to contribute to the 2007 iNEMI Roadmap process.

Benefits of participation
     � Get an advance look at draft chapters of the 2007 iNEMI Roadmap.
     � Gain an understanding of the iNEMI roadmapping process in terms of its current capabilities and impact.
     � Opportunity to interact with key technology and business leaders as well as iNEMI staff.
     � Participation in the 2007 Roadmap workshop will help you gain an early insight into the likely future direction of the
       electronics industry by helping to identify technology and business gaps. This collaboration can influence the
       strategy and investments of your company as it considers future plans for technology and supply chain initiatives.

Preliminary Agenda

Wednesday, May 17, 2006

7:30 am	Continental Breakfast
7:50 am	Welcome/Overview	Jim McElroy, iNEMI Chuck Richardson, iNEMI
8:20 am - 5:00 pm	Technology Working Group Reports (20 minutes each)
	Business Processes/Technologies:
8:20 am	Product Lifecycle Information Management	Eric Simmon, NIST
	Design Technologies:
8:40 am	Modeling, Simulation & Design Tools	SB Park, Binghamton Univ
9:00 am	Thermal Management	Carl Fisher, 3M
9:20 am	Environmentally Conscious Electronics	Mark Newton, Dell
9:40 - 10:10 am	Discussion/Break
	Manufacturing Technologies:
10:10 am	Board Assembly	David Geiger, Flextronics
10:30 am	Test, Inspection & Measurement	Mike Reagin, Delphi
10:50 am	Final Assembly	Steve Davidson, Delphi
	Component Subsystem Technologies:
11:10 am	Packaging	Joe Adam, Skyworks
11:30 am	RF Components & Subsystems	Steve Kenney, Georgia Tech
11:50 am	Organic Substrates	Jack Fisher, IPC/iNEMI
12:10 pm	Optoelectronics	Rick Clayton, Consultant
12:30 - 1:30 pm	Lunch/Discussion
1:30 pm	Mass Data Storage	Tom Coughlin, Consultant
1:50 pm	Connectors	John MacWilliams, Consultant
2:10 pm	Energy Storage Systems	Ralph Brodd, Broddarp
2:30 pm	Interconnect Substrates - Ceramic	Howard Imhof, Metalor
2:50 - 3:20 pm	Discussion/Break
3:20 pm	Passive Components	Joe Dougherty, Penn State
3:40 pm	Sensors	Tim McBride, TI
4:00 pm	Semiconductor Technology	Alan Allan, Intel
4:20 pm	Organic and Printed Electronics	Dan Gamota, Motorola
4:40 - 5:00 pm	Discussion/Break
5:00 pm	Summary	Chuck Richardson, iNEMI Bob Pfahl, iNEMI
5:30 pm	Close

Hotels

Registration and additional information
iNEMI membership is not required to participate in this workshop. The workshop fee is $200 (waived for iNEMI members) and includes a continental breakfast, lunch and a copy of the 2007 iNEMI Roadmap CD (which sells for $250) when published in February 2007.

Click here to register (online registration; requires credit card payment � MasterCard, VISA, American Express and Discover accepted).

Click here for additional information about the 2007 iNEMI Roadmap.

For additional information, please contact Chuck Richardson, iNEMI, at +1 256-880-0922, chuck.richardson@inemi.org.