Calendar
Tin Whisker Workshop
Tuesday, May 31, 2005
Sponsored by iNEMI, ECTC and CPMT as part of the
55th Electronic Components and Technology Conference (ECTC)
Wyndham Palace Resort and Spa
Lake Buena Vista, Florida
Agenda
Press release
The second Tin Whisker Workshop, held as part of ECTC, builds on much of the material presented at ECTC 2004 (in Las Vegas). Attendees at this workshop will receive the latest data and thinking from leading international experts on tin whisker phenomena.
The International Electronics Manufacturing Initiative (iNEMI) has now completed its third set of whisker experiments, totaling more than 9,000 hours of testing. Results, which provide additional insight into tin whisker formation and growth, will be presented at this workshop along with other industry data. Theories will cover the cause and effect of stress formation in the tin film, the mechanism by which material moves through the structure, and the "end game" — what makes the whisker grow. A new factor in tin whisker generation that needs to be understood is heavy oxidation or "corrosion" of the tin in humid environments. Data on testing, and the impact of oxidation on whisker growth will be discussed.
Chair: Ron Gedney, iNEMI
Co-Chair: Maureen Williams, NIST
Moderator: Dr. Henning Leidecker, NASA
Registration
Registration for the workshop is $75, plus participants must register for a minimum of one day’s attendance at the conference. Click here for online registration.
Agenda
8:15 a.m. Introduction and Overview
H. Leidecker, NASA
8:30 Results: iNEMI DOE #3
V. Schroeder, HP
9:30 Whisker and Hillock Formation on Sn, Sn-Cu and Sn-Pb Electrodeposits
W. Boettinger, NIST
10:00–10:20 Break
10:20 Integrated Theory for Whisker Formation:
Kirkendall Effect and Whisker Formation
G. Galyon, IBM
Stress Measurements in Thin Films
• Flexure Beam Analysis
S. Lal, FCI Connect
• X-RD Measurements
Chen Xu, Cookson Electronics
Film Crystallography and Whisker Formation
A. Frye, IBM
Noon - 1:15 Lunch
1:15 Humidity Effects on Sn Whisker Formation
M. Dittes, Infineon
1:45 A Statistical Study of Sn Whisker Population and Growth during Elevated
Temperature/Humidity Storage Test
Peng Su, Freescale Semiconductor
2:15 Sn Corrosion and its Influence on Whiskers
J. Osenbach, Agere
3:00 – 3:20 Break
3:20 Whisker Initiation & Growth (the "End Game")
J. Smetana, Alcatel
3:50 SEM Analysis of Tin Electrodeposits
A. Egli, Rohm & Haas
4:20 Surface Structure Effects of Sn Electrodeposits on Sn Whisker Growth
Kil-Won Moon, NIST
4:50 Wrap-up
H. Leidecker