The presentations from this workshop are available to iNEMI members and to non-members who attended the workshop.  Attendees will receive a CD in the mail.  In addition, non-members who did not attend the workshop can purchase the CD for a fee of $75 (the registration fee for the workshop).  Members can download presentations by clicking on the links below and entering the website password.  Members who need help with the password, or non-members who want to purchase the CD, can contact help@inemi.org or call 703-834-0330.

A presentation from the iNEMI Accelerated Tin Whisker Test Committee is now available for free download.  The title of this presentation is:  "The Effect of Temperature and Humidity Variations on Whisker Growth:  Results of iNEMI Environmental Testing."

Final Presentations

Introduction – Carol Handwerker, Purdue University

Accelerated Tin Whisker Test Committee Update – Phase 5 Evaluation (The Effect of Temperature and Humidity Variations on Whisker Growth:  Results of iNEMI Environmental Testing) – Heidi Reynolds, Sun Microsystems

Pitfalls in Physical Measurements of Tin Whiskers – John Osenbach, Agere Systems

Correlation between Whisker Initiation and Compressive Stress in Electrodeposited SnCu Coating on Cu Leadframe – Takahiko Kato, Hitachi, Ltd.

No Interfacial IMC (Bright Sn and SnCu Electrodeposits on Substrates Not Forming Interfacial Intermetallic Compounds:  Observation of Hillock and Whisker Growth and Stress Measurements by Beam Deflection Method) – Maureen Williams, NIST

Matte Sn Electroplating in Mass Production and Testing According to JESD201 – P. Oberndorff, NXP Semiconductors

Whisker to Hillock Transition:  Stress Relaxation Mechanisms in Sn, Sn-Cu, and Sn-Pb Films – Carol Handwerker, Purdue University

Residual Stress Measurement of Sn Deposits:  Progress Report - Maureen Williams, NIST and Robert Hilty, Tyco Electronics Corporation

Quantifying the Role of Stress on Whisker Nucleation and Growth – Robert Hilty, Tyco Electronics Corporation

Stress Measurements in Tin Films – George Galyon, IBM Corporation

Tin Whisker Mitigation - User Perspective – Joe Smetana, Alcatel-Lucent

Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part II – Thomas Woodrow, Boeing Phantom Works