Newsroom
Lead-Free Assemblies
Tin Whiskers
Factory Information Systems and Supply Chain Communication
Interconnect Substrates
General/Opinion
Board/Package Assembly - Process, Materials and Infrastructure
Optoelectronics
Lead-Free Assemblies
Lead-Free Watch: Countdown to July 1, 2006. This series of articles appeared in Circuits Assembly and PCD&M magazines between January 2005 and July 2006. The series covered a variety of topics to help readers prepare for the RoHS Directive deadline.
Pb-Free Reflow and Rework (cover story), Matt Kelly (Celestica International), Quyen Chu (Jabil Circuit) and Jasbir Bath (Solectron Corporation), Circuits Assembly, November 2004, pp. 32-35.
Perspectives: Rapid Rampup to Lead-Free Production Stresses Supply Chain, Dave McCarron (Dell), SMT magazine, August 2004, p.20.
Industry Voices: New Lead-free Processes Require Industry Collaboration, Frank Grano (Sanmina-SCI), Advanced Packaging, June 2004 (requires free registration/log-in to access online), p.22.
NEMI's Lead-Free Alloy: Still on Target, Alan Rae, Cookson Electronics, and Carol Handwerker, NIST, Circuits Assembly, April 2004 (cover article), pp. 20-25.
"Lead-Free Rework Development at NEMI," Charlie Reynolds and Jerry Gleason (p.19), sidebar to "Rework with Lead-Free Solders (cover story), Circuits Assembly, August 2003, pp. 18-21.
"Annotated Tin Whisker Bibliography," Dr. George T. Galyon, IBM Server Group; February 2003 (updated July 2003)
"NEMI Report: A Single Lead-Free Alloy is Recommended," Edwin Bradley, Motorola; Carol Handwerker, NIST; and John E. Sohn, cover story, SMT, January 2003.
"A Manufacturable Lead-Free Surface-Mount Process?" by Jasbir Bath, Circuits Assembly, January 2003, pp. 26-29.
"Roadmap of Lead-Free Assembly in North America," JISSO/PROTEC Forum 2002, November 19-20, 2002; Japan.
"Are Lead-Free Solder Joints Reliable?", John E. Sohn, Ph.D., Circuits Assembly, June 2002, p. 31
"Environmental Work Goes On," by Edwin Bradley, Motorola, Electronic News, January 21, 2002, p.20.
"Characterization of the Melting and Wetting of Sn-Ag-X Solders," by Edwin Bradley III, Motorola, and Jasmina Hranisavljevic, Argonne National Laboratory, IEEE Transactions on Electronics Packaging Manufacturing, Vol., 24, No. 4, October 2001.
"Database on Lead-Free Solders," T.A. Siewert, D.R. Smith, S. Liu, and J.C.Maden, Proceedings of the Electronic Components and Technology Conference, 2001
"Environmentally Conscious Electronics: A Trend Driven by Global Regulations and Aggressive Marketing Strategies," Holly Evans and Ron Gedney, Advanced Packaging, April 2001.
"What�s Up with Lead-Free?" Brenda Baney, PC Fab, May 2001 (article is not available online yet).
"Green Thoughts: On Industry Roadmaps and EHS Issues," Brenda Baney, PC Fab, January 2001. (article is not available online yet).
"Last Word: The Lead-Free Conundrum," Jim McElroy, Electronic Packaging & Production, September 2000 (requires log-in).
"The Next No-Lead Hurdle: the Components Supply Chain," Richard Parker, CircuiTree, August 2000.
"Research Update: Lead-Free Solder Alternatives," Jasbir Bath, Carol Handwerker and Edwin Bradley, Circuits Assembly, May 2000.
"Lead-Free Project Focuses on Electronics Assemblies," Edwin Bradley, Jasbir Bath, Gordon Whitten and Srinivas Chada, Advanced Packaging, February 2000.
"Lead-Free Update: Industry-Based Effort Pushes for Lead-Free Assemblies," Edwin Bradley, Ken Snowdon, Ronald Gedney, Circuits Assembly, December 1999.
"Towards a Green 2000" (a whitepaper discussion of the WEEE Directive in Europe), Ken Snowden, Nortel Networks.
Tin Whiskers
AVAILABLE from IEEE: IEEE Transactions on Electronics Packaging Manufacturing � Special Issue on Tin Whiskers (issue date: January 2005; released May 2005). Download order form.
Industry Voices: Tin Whiskers: An Industry Perspective, Phil Garrou (CPMT Society) and Ron Gedney (NEMI consultant), Advanced Packaging, December 2004.
Cause of Tin Whiskers Remains Elusive, George Galyon (IBM), Joe Smetana (Alcatel), and Nick Vo (Freescale Semiconductor), Lead-Free Electronics, November 2004.
Avoiding Tin Whisker Reliability Problems, G.T. Galyon (IBM) and Ron Gedney (NEMI), Circuits Assembly, August 2004, p. 26.
Tin Whisker Acceptance Test Requirements (NEMI Tin Whisker User Group, updated July 28, 2004) paper __ presentation
Annotated Tin Whisker Bibliography and Anthology, Dr. George T. Galyon, IBM; (updated November 2003, v1.2)
NEMI Recommends Standard Test Methods to Assess Propensity for Tin Whisker Growth, Nhat Vo, Motorola; Irina Boguslavsky, EFECT, LLC; and Peter Bush, SUNY Buffalo; SMT magazine, November 2003, pp. 36-41.
Factory Information Systems and Supply Chain Communication
IPC PDX Standards, RosettaNet PIPs Support Flexible Supply Chain Relationships, Barbara Goldstein (NIST) and Richard Kubin (E2open), SMT, October 2004, pp 34.
Data Exchange Standards Improve Supply Chain Communication Richard Kubin (E2open) and Dana Korf (Sanmina-SCI), sidebar to "Supply Chain Collaboration: Managing the Most Cost-Effective Supply Chain," Circuits Assembly, July 2004, p. 32.
"The Key to the Electronics Lifecycle," Richard Kubin, E2open, and Barbara Goldstein, NIST, APICS - The Performance Advantage, November/December 2003 (cover story), pp. 33-35.
"PCB Equipment Communication Standards Today and Tomorrow," Brian Rubow, Cimetrix, Inc., APEX 2003, April 2, Anaheim, CA.
"Lessons Learned from the IPC-2501 Testbed Prototype Performance Test at a Motorola Factory," D. Pattyn and M. Motherway, Motorola, APEX 2003, April 2, Anaheim, CA.
"Speaking a Common Language," Von Campbell, Agilent Technologies, IPC Review, February 2003, pp. 14-16.
"Searching for the Perfect BOM," Kenneth Chow and Jim McElroy, Circuits Assembly, October 2002, pp. 26-28.
"Smart BOMs," Kenneth Chow and Steve Christensen, Design Engineering, September 1, 2002. (NOTE: site access is free, but registration is required. Log onto site, then search archives for publication date.)
"Association Voices: CAD/CAM Data Exchange - Cooperative Competition is Key!" Jim McElroy, EP&P, August 2002, p.24 (requires log-in).
"The Quest for a Single CAD/CAM Data Exchange Standard," Henry Jurgens and Dana Korf, Circuits Assembly online exclusive, May 2002.
"NEMI: Convergence Project Focuses Industry Effort on Developing a Single Standard for CAD/CAM Data Exchange," Jim McElroy, GOOD-DIE Newsletter, Newsletter 12 (April 2002). (Note: log onto site and select newsletter, then Newsletter 12.)
"In Search of the Perfect Bill of Materials (BoM)" (a whitepaper by the NEMI Perfect BoM Team, March 2002)
"NEMI Data Exchange Convergence: Meeting an Industry Need" Jim McElroy, CircuiTree, June 2001, p. 106 (sidebar to "All Together Now: Data Design Exchange for New Product Introduction", Randy Allen and David Bergman, p. 106).
"Supply Chain Management," sidebar to "Is Outsourcing for Everyone?" (cover story), SMT, April 2001.
"The Framework Implementation Project," Andrew Dugenske, P.E., Circuits Assembly, March 2001, p. 51.
"NEMI�s Jim McElroy: �e-commerce fits new supply chain�," M&A/Partnerships, PCB 007 (01.24.01).
"Plug and Play Creates Manufacturing Interoperability," Allan Fraser, Robert Voitus and Andrew Dugenske, Electronic Packaging & Production, December 2000 (requires log-in).
"Virtual Factory: Improving Supply Chain Communications," Barbara Goldstein and John Cartwright, Circuits Assembly, September 2000.
"The National Electronics Manufacturing Initiative�s (NEMI) Plug and Play Factory Project," Andrew Dugenske, Allan Fraser, Tuan Nguyen and Robert Voitus, International Journal of Computer-Integrated Manufacturing, Volume 13, Number 3 (May 1, 2000) pp 225-244.
"Restructuring of Electronics Industry: Anchors on the Slippery Slope of Outsourcing," Jim McElroy and Rod Walker, Future EMS International, Issue 3, 2000.
"A Standards-Based Approach to Integrating Information Across the Electronics Manufacturing Supply Network," Barbara Goldstein, presentation to the Electronic Circuits World Convention 8 (ECWC8), Tokyo, September 1999.
"Opening Up to Standardization," Barbara Goldstein and John Cartwright, Circuits Assembly, June 1999
"Virtual Factory Project Tackles Integration of Supply Chain Systems," John Cartwright, Joanne Friedman, Barbara Goldstein, John Minchella, Future EMS International, Issue 2, 1999.
"Open Architecture Platforms," Dave Faulkner, Ben Levy, and Tim Garner, Circuits Assembly January 1999.
Interconnect Substrates
"NEMI Roadmap: The Impact of Density and Frequency on Organic Interconnect Substrates," John T. (Jack) Fisher, PCFab, March 2003, pp. 20-23.
"Highlights of the 1998 NEMI Roadmap," Leo Feinstein, HDI Magazine, April 1999.
"NEMI Roadmap Points to Increasing Density of PWBs and Emergence of Microvia Technology," Jim McElroy and John T. (Jack) Fisher, Future Circuits International, Issue 5, second quarter 1999.
"Implementing Microvia and Flip Chip Technologies," Jim McElroy, HDI Magazine, September, 1998.
"The Future is Organic Substrates," John T. (Jack) Fisher and Ronald Gedney, PC Fab, August 1999.
Components
SiP Technology Offers Packaging Alternatives for Design, Joseph Adam (Skyworks Solutions) and Mark Bird (Amkor Technology), Advanced Packaging (cover story), September 2004, p.16.
General/Opinion
Sensor Technology Roadmapping Efforts at iNEMI,
Charles E. Richardson (iNEMI); Ray Roop and Steve Hendry (Freescale
Semiconductor); and Michael H. Azarian, Sanka Ganesan, and Michael
Pecht (CALCE/University of Maryland), IEEE Transactions on Components and Packaging Technologies (Vol. 28, No. 2, pages 372-375). By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
"NEMI road map forecasts stronger links," Electronic Business, May 1, 2003.
"The Electronics Industry - Where are We Headed?" Jim McElroy and Rod Walker, Future EMS International, Issue 3, 2000
"Closing the Roadmap Gaps... and Where OEMs and Their Suppliers Fit In," Jim McElroy, PC Fab, March 2000.
"R&D Leadership - Where will it come from?" Jim McElroy and John T. (Jack) Fisher, PC Fab, August 1999.
Board/Package Assembly � Process, Materials and Infrastructure
SiP Technology offers Packaging Alternatives for Design (cover story), Joseph Adam (Skyworks Solutions, Inc.) and Mark Bird (Amkor Technology, Inc.), Advanced Packaging, September 2004, pp16-20 (requires registration to access article).
"Integrated Passives Technology and Economics," Joseph P. Dougherty, Penn State Materials Research Institute (State College, PA), Circuits Assembly, September 2003, pp. 18-23.
"The Road Ahead for Board Assembly," Kirk Van Dreel, Plexus Corporation, and Alex Chen, Celestica Inc., Circuits Assembly, June 2003, pp. 16-19.
"Final Assembly Challenges", Mike Reagin and Greg Holcomb, Circuits Assembly, November 2001, p. 34
"Embedded Passives: Promising Improved Performance" Larry Marcanti and Dr. Joseph P. Dougherty, Circuits Assembly, July 2001, p. 28
"High-Throughput RFIC Wafer Testing", Eric W. Strid, 57th IEEE Automatic Radio Frequency Techniques Group Conference Digest, May 2001.
"NEMI Roadmap Looks to Future of Board Assembly," by Linda Klober and Bill Barthel, Circuits Assembly online exclusive, April 2001 (article is not available online yet).
"Roadmapping the PCB Assembly Future," Tom Davison and Bill Barthel, Circuits Assembly, May 1999.
"Flip Chip Technology in Organic Chip Carriers," Bahgat Sammakia, Frank Andros and Ronald Gedney, Circuits Assembly, February 1999.
"New Materials and Processes will Improve Underfill for Flip Chip Applications" (sidebar), Jack Morris, Advanced Packaging, September/October 1998.
"Optimize Yield Through Solder Paste Inspection and Control," David Clark; sidebar to "Pathways to SMT: Soldering," SMT, August 1998.
Optoelectronics
Cleaning Standards for Fiber Optic Connectors Promise Time and Cost Savings, Tatiana Berdinskikh (Celestica, Inc.) and Heather Tkalec (Alcatel), Photonics Spectra, June 2004, p.66.
"At the core: how scratches, dust, and fingerprints affect optical connector performance," Tatiana Berdinskikh, Celestica; Heather Tkalec, Alcatel Canada; and Jennifer Nguyen, Solectron, Connector Specifier, January 2004, pp. 10-11.
"NEMI Highlights Areas of Growth for Optoelectronics in Network Technology," John Stafford, cover story, Optoelectronics Manufacturing, June/July 2003.
"NEMI's Effort to Make Optoelectronics Manufacturing Mainstream," Alan Rae, Cookson Electronics, and Ron Gedney, NEMI, (presented at, and published in the proceedings of, SMTA - Optoelectronics and the Telecom Revolution, November 13-15, 2001, Dallas).
"Assembly Using Optoelectronic Packages," Alan Rae, IMAPS 2001 Conference, September 24, 2001, Oslo, Norway
"Packaging and Physical Design in the Bandwidth Era," John Stafford, PC Fab, May 2001 (cover story), p. 34
"Optotelectronic Components Place New Demands on Package and Assembly,", John Stafford, CircuiTree, April 2001 (cover story), p. 117.
"Last Word: Optoelectronics: A Critical Technology Driver," John Stafford, EP&P, March 2001 (requires log-in).