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iNEMI Presents Project Results and Discusses
New Project Effort at IPC Printed Circuits
Expo, APEX & the Designers Summit


HERNDON, Va. (February 13, 2008) - The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium focused on identifying and closing technology gaps, will review results from three projects and hold an open meeting of a fourth at IPC Printed Circuits Expo, APEX & the Designers Summit (March 29 - April 3; Las Vegas, Nevada).

The iNEMI Lead-Free Forum (Forum F01, Tuesday April 1, 1:30-3:00 p.m.) will review Phase I results of iNEMI's Pb-Free Wave Soldering Project and final results from the recently completed Pb-Free BGAs in SnPb Assemblies Project. This session is free for anyone attending the exhibition.

Also on Tuesday, Jasbir Bath (Flextronics International), chair of iNEMI's Pb-Free Rework Optimization Project, is presenting a paper entitled, "iNEMI Rework Machine Temperature Tolerance and Repeatability Study" as part of Session S08-Rework and Repair (Tuesday, April 1, 3:15-4:45 p.m.).

The Pb-Free BGAs in SnPb Assemblies Project will be discussed again in a technical session on Wednesday.  Project chair Robert Kinyanjui (Sanmina-SCI) will present "Solder Joint Reliability of Pb-Free SnAgCu Ball Grid Array (BGA) Components in SnPb Assembly Process," as part of Session S15-Backward Compatibility: Where Leaded and Lead-Free Collide (Wednesday, April 2, 9:00-10:00 a.m.).  This paper reports on the project team's experimental investigation of the reliability of solder joints of SAC BGA components formed using SnPb solder paste.  This paper discusses the impact of various profiles' characteristics on solder joint reliability.

Finally, the iNEMI Halogen-Free Project team will hold an open meeting on Wednesday, April 2, 1:00-3:30 p.m. The initial Halogen-Free Project has been developing guidelines for standardized materials, manufacturing, assembly and test for "halogen-free" printed wiring boards based on market segment requirements and technical, commercial and functional viability. This meeting will discuss and develop plans for future iNEMI halogen-free activities.

Cllck here for additional information.

About iNEMI
The International Electronics Manufacturing Initiative's mission is to identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure.  This industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities.  iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies.  The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.  iNEMI is based in Herndon, Va., with regional offices in Shanghai, China and Limerick, Ireland.  For additional information about iNEMI, visit http://www.inemi.org.

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For further information:
Cynthia Williams, iNEMI
+1 207-871-1260
cwilliams@inemi.org