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iNEMI Roadmap Workshop is Scheduled in Shanghai

28 July meeting held in conjunction with ICEPT-HDP conference

SHANGHAI, China (June 13, 2008) - The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium focused on identifying and closing technology gaps, has scheduled a workshop in Shanghai to give industry the opportunity to review “work in progress” on the 2009 iNEMI Roadmap.  The all-day workshop will be held in conjunction with the ICEPT-HDP conference at the Riverfront Business Hotel in Zhangjiang, Pudong.  This workshop is the third of three regional meetings held in North America, Europe and Asia, and is an important part of the iNEMI roadmap cycle.

“The roadmap workshops give participants from the electronics industry an advance look at drafts of select roadmap chapters,” said ZHU Jian, head of Alcatel-Lucent’s Core manufacturing Center in Shanghai and chair of the iNEMI China Steering Committee.  “At the same time, it allows the authors of the chapters to get valuable feedback from industry — a ‘reality check’ on the work they’ve done to date. And it helps ensure that the concerns and issues of the electronics manufacturing sector in Asia are addressed in the 2009 Roadmap.”

“iNEMI membership is not required to attend the workshop, or to participate in the roadmap,” said Haley Fu, PhD, iNEMI manager of operations, Asia.  “We encourage anyone from within the electronics manufacturing supply chain — OEMs, EMS providers, suppliers — to take advantage of this great opportunity.”

A review of drafts of select roadmap chapters will give participants the opportunity to discuss key product sectors and technology and infrastructure areas.  Chapters to be covered include:

  • Product sectors: office systems, portable/consumer, automotive and netcom (network/datacom/telecom)
  • Environmentally conscious electronics
  • Test, inspection & measurement
  • Modeling, simulation & design tools
  • Board assembly
  • Final assembly
  • Organic substrates
  • Packaging

The workshop registration fee is US$300 (which is waived for iNEMI members, workshop speakers and government officials).  This fee covers participation in the workshop lunch, plus a copy of the 2009 iNEMI Roadmap CD when published in March 2009.  (The roadmap sells for US$325 outside of North America.)

For each roadmap cycle, iNEMI determines which topics will be covered according to what is happening in industry and what changes are expected to have the greatest effect on electronics manufacturing. The 2009 Roadmap covers 22 technology, infrastructure and business process areas. New in this roadmap are chapters on solid state illumination, RFID item-level tag and photovoltaics. These topics have been added in response to increased industry interest in the opportunities and technology needs of these potential growth areas.

Registration deadline for the Asian workshop is 22 July.  For additional information about, or to register for, the workshop, go to
http://www.inemi.org/cms/calendar/2009_RM_workshop_Asia.html

About the iNEMI Roadmap
Since 1994, iNEMI has mapped the future manufacturing technology needs of the global electronics industry in an effort to identify key technology and infrastructure developments needed to ensure the competitiveness of the supply chain over the next decade. The iNEMI roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.  It also helps set priorities for research and development over the next 10 years, and is not only used by industry but also by government funding agencies and university-based research programs.

Efforts are organized into Product Emulator Groups (PEGs) and Technology Working Groups (TWGs). The PEGs define the future technology needs of “virtual products” from five areas: 1) automotive, 2) consumer/portable, 3) medical, 4) netcom (network, datacom and telecom) and 5) office/large business systems. Each PEG chapter forecasts future product attributes, including cost and density drivers.

The TWGs forecast trends for numerous technology and infrastructure areas and contrast those trends with anticipated product needs. The TWGs predict the evolution of technology and/or business practices, identify gaps and “showstoppers” in existing technology and infrastructure, and develop recommendations for their respective areas.

For additional information about the 2009 iNEMI Roadmap, go to
http://www.inemi.org/cms/roadmapping/2009_Roadmap.html

About iNEMI
The International Electronics Manufacturing Initiative’s mission is to identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure.  This industry-led consortium is made up of more than 65 manufacturers, suppliers, industry associations and consortia, government agencies and universities.  iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies.  The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.  iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China and Limerick, Ireland.  For additional information about iNEMI, visit http://www.inemi.org.

For further information:
Cynthia Williams, iNEMI-US
+1 207-871-1260
cwilliams@inemi.org

中文版本请联系
Haley Fu, iNEMI-Asia
haley.fu@inemi.org
+86-21-58353839