Wednesday, February 8

F01 iNEMI Pb-Free and RoHS Update

Introduction to iNEMI Lead-Free and RoHS Update Free Forum

Pb-Free BGAs in SnPb Assembly Process Study, Robert Kinyanjui, Sanmina-SCI; Quyen Chu, Jabil Circuit  Inc.

Evaluation of Substrate Surface Finishes for Pb-free Assembly Project, Keith Newman, Sun Microsystems

Lead Free Wave Soldering Initiative, Denis Barbini, Vitronics Soltec; Paul Wang, Microsoft Corp.

Lead-Free Rework Optimization Project, Jasbir Bath, Solectron

iNEMI Halogen-Free Project, Steve Tisdale, Intel; Roger Krabbenhoft, IBM

iNEMI RoHS Update:  IPC-1752, Materials Declaration Management & Implementation of Material Composition Data Exchange Project, Richard Kubin, E2open

S04 Tin Whiskers

iNEMI Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products, Joe Smetana, Alcatel

iNEMI Halogen-Free Initiative

New iNEMI Initiative - Halogen-Free Project, Steve Tisdale, Intel; Roger Krabbenhoft, IBM

F02 Roadmapping Interconnect Technology 2006

Technology Roadmaps:  Driving Industry Collaboration, Chuck Richardson, iNEMI

Thursday, February 9

F03 Copper vs Optoelectronics in PCBs

iNEMI Optoelectronic Substrates Project, Jack Fisher

iNEMI Pb-Free DPMO Project

Pb-Free Defects Per Million Opportunites (DPMO) Project Proposal, David Godlewski, iNEMI     presentation     SOW