Background and Agenda, Jim McElroy, iNEMI

Situation Analysis

Consumption of BGA and CSP Packages in High Reliability Environments, Brandon Prior, Prismark Partners

User Perspective, Ken Stuchlik, Alcatel-Lucent

Supplier Viewpoints

Micron Technology, Craig Stice, Micron Technology

Freescale Semiconductor, Wayne Lindsay, Freescale Semiconductor

ST Microelectronics, Michael Hundt, ST Microelectronics

STATS ChipPAC, Pranab Sarma, STATS ChipPAC

Knowledge Gaps for Industry

Establishing Common Industry Position for High Rel Pb-Free Conversion, Jim McElroy, iNEMI

Reliability Knowledge Gaps, Joe Smetana, Alcatel-Lucent

Manufacturing Knowledge Gaps, Thilo Sack, Celestica

Solution Discussions

Framework for Solution Discussions

Click here for further information about this project