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iNEMI Meetings at Productronica 2007
13-16 November 2007
Muniche Messe
Munich, Germany

Tuesday, 13 November

iNEMI Advanced Materials Research Projects
     iNEMI Overview & Agenda Review, Jim McElroy, iNEMI
     Overview of Thrust Areas and Materials Projects, Bob Pfahl, iNEMI
     Pb-Free Nano-Solder Project, Ning-Cheng Lee, Indium
     Materials for Printed Electronics, Andreas Schaller, Motorola
     Nano-Attach Project, Grace O'Malley, iNEMI
     Halogen-Free Project, Bob Pfahl, iNEMI
     Introduction to Next Steps on Pb-Free, Jim McElroy, iNEMI

Development Needs for High Reliability Pb-Free Electronics (file includes the following)
     Agenda, iNEMI Overview & High Reliability Task Group, Jim McElroy, iNEMI
     Presentations from March 2007 Workshop on Availability of SnPb BGAs:
        Availability of SnPb BGAs for High-Reliability, Jim McElroy, iNEMI
        Access to SnPb BGA Components: User Perspective, Ken Stuchlik, Alcatel-Lucent
        Pb-Free and Green, Craig Stice, Micron Technology
        BGA Availability for High-Reliability Applications: EMS Perspective, Thilo Sack, Celestica
        Discussion Points and Next Steps
     High-Reliability Transition Strategy, Mike Davisson, Agilent Technologies
     Pb-Free Early Failure Study, Anthony Primavera, Boston Scientific
     Update on Pb-Free Alloy Alternatives, Anthony Primavera, Boston Scientific
     Pb-Free BGAs in SnPb Assembly Project, presented by Chuck Richardson, iNEMI

2007 iNEMI Research Priorities and 2009 Roadmap, Bob Pfahl, iNEMI

2007 iNEMI Roadmap/European Kick-Off Meeting
     Introduction and Agenda, Chuck Richardson, iNEMI
     2009 Roadmap Process Overview, Chuck Richardson, iNEMI
     IEEE/CPMT Participation in Roadmap, Rolf Aschenbrenner, Fraunhofer IZM
     IMAPS Europe Participation in Roadmap, Giovanni Delrosso, Pirelli Labs 
     2007/2009 Automotive PEG, Peter Grossman, Delphi Germany
     2007/2009 Portable/Consumer PEG, Bob Pfahl, iNEMI, for Susan Noe, 3M
     2007/2009 Medical PEG, Anthony Primavera, Boston Scientific
     2007/2009 Netcom PEG, Jim McElroy, iNEMI
     2007 Environmentally Conscious Electronics TWG, PanFeng CHEN, Huawei
     2007 Board Assembly TWG, Fredrick Mattson, Flextronics
     2007 Final Assembly TWG, Reijo Tuokko, Tampere University of Technology
     2007 Packaging TWG, Juergen Wolf, Fraunhofer IZM

Optimization of Pb-Free Soldering
     Lead-Free Wave Soldering, Denis Barbini, Vitronics Soltec