Newsroom
October 18-20, 2004
StorageTek, Inc., Louisville, CO
Presentations from the RoHS/Lead-Free Summit are available below. All files are downloadable PDFs, unless otherwise noted.
Monday, October 18, 2004
Summit Introduction & Overview, Bob Pfahl, NEMI
NEMI Welcome, Jim McElroy, NEMI
Session I: Regulatory Environment
Chair: Holly Evans, Strategic Counsel, LLC
Environmental Regulations and the Electronics Industry, Holly Evans, Strategic Counsel, LLC
WEEE and RoHS Basics, Update and Open Issues, Jean-Philippe (JP) Brisson, Allen & Overy
Chinese Regulations, Becky Linder, AEA
Update on US Recycling and Mercury Initiatives, Jason Linnell, EIA
Overview on European Environmental Regulatory Issues for Consumer Electronics, Joe Johnson, Microsoft Home & Entertainment Division
Session II: Status of Manufacturing Process Technology
Chair: Bob Pfahl, NEMI
Status of Manufacturing Process Technology - session scope/goals, Bob Pfahl, NEMI
State of the Pb-Free Process Technology
Lead-Free Reflow Oven and Rework Machine Status; Lead-Free Component and Board
Temperature Requirements, Jasbir Bath, Solectron Corporation.
Lead-Free Wave Soldering, Ursula Marquez, Vitronics Soltec (3.33 MB)
State of Component Technology
NEMI Sn Whisker Projects Status, Robert Hilty, Tyco Electronics Corporation (11.9 MB)
Elimination of RoHS Substances in electronic Products, Joe Johnson, Microsoft Home & Entertainment Division
NEMI RoHS Transition Task Group-Process Standards, Frank Grano, Sanmina-SCI
Dinner Speaker
Lead-Free Logistics - The Impact of RoHS Legislation on the Electronic Component Supply Chain, Tim Ballard, Avnet Inc.
Tuesday, October 19
Session III: Status of RoHS Standards
Chair: Fern Abrams, IPC
Status of RoHS Standards, Fern Abrams, IPC
Material Declaration: EIA, EICTA, JGPSSI Update, Todd Brady, Intel Corporation
IEC Procedures for the Determination of Regulated Substances in Electrotechnical Products, Todd Brady, Intel Corporation
Marking and Part Numbering Team - NEMI RoHS Transition Task Group, Vivek Gupta, Intel Corporation
Session IV: Status of RoHS Implementation
Chair: Dave McCarron, Dell
Status of RoHS Implementation - session scope/goals, Dave McCarron, Dell
NEMI Component Supply Chain Readiness Project, Alan Ater, Sanmina-SCI
Development of Industry-Wide Best Management Practices for RoHS Compliance, Holly Evans, Strategic Counsel, LLC
StorageTek's RoHS/WEEEE Projects, Jim Goeppinger, StorageTek
Session V: Business-to-Business Data Exchange
Chairs: Jim McElroy, NEMI, and Richard Kubin, E2open
Business-to-Business Data Exchange - session scope and goals, Jim McElroy, NEMI
NEMI Materials Declarations Team - Phase 2, Nancy Bolinger, IBM
NEMI Materials Declaration Request and Reporting Format, updated October 15, 2004 (Excel)
NEMI Materials Declaration Process Flow
RoHS/WEEE Implementation - Component Supplier Perspective, Mark Frimann, Texas Instruments
Working with Stakeholders to Do the Right Thing (RoHS/WEEE Implementation - EMS Perspective), Eric Austerman, Jabil Circuit Inc.
Lessons Learned from the End-of-Life Vehicle (ELV) Directive and Applicability to WEEE and RoHS, Chris Harden, MDSMap
MCD: Making Sense out of Chaos, Richard Kubin, E2open
Session VI: Town Hall Meeting to Identify Gaps and Next Steps
Chair: Dave McCarron, Dell
Town Hall Discussion - introduction, Dave McCarron, Dell
NEMI RoHS/Pb-Free Summit Wrap Up, Bob Pfahl, NEMI
Wednesday, October 20
Session VII: Working Discussions on Key Topics
Development of Industry-Wide Best Management Practices (Moderator: Holly Evans)
Communications and Education (Moderators: Jim McElroy, NEMI, and Fern Abrams, IPC)
Shared Materials Database (Moderator: Eric Austerman, Jabil Circuit)
High-End Electronics (David Cavanaugh, Benchmark)