Newsroom

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Material Declaration of Components and Electronic Assemblies:
Data Exchange Solutions for Global Environmental Requirements
August 30-31, 2004
Hosted by Intel, Santa Clara, CA

Organized by the International Electronics Manufacturing Initiative (iNEMI), the iNEMI
Materials Composition Data Exchange initiative, and the IPC Product Data eXchange
(PDX) standards committees

Monday, August 30

Agenda & Objectives

WEEE and RoHS Directives: Implications for Material Composition Data Exchange and Reporting, Jean-Philipe Brisson, Allen & Overy

Review of Industry Declaration Guides

• EIA/JGPSSI/EICTA Joint Industry Guide, Todd Brady, Intel
• Material Declaration:  Who’s In Charge?, Dieter Bergman, IPC
• NEMI Materials Declaration Project: WEEE and Data Collection, JB Hollister, JB Hollister Consulting

Material Declaration Exchange Requirements Panel

• Introduction/Overview, Nancy Bolinger, IBM

OEM

• OEM Data Requirements, Butch Morel, Lucent Technologies
• HP Requirements, Diane Fisher, HP

EMS

• Celestica Requirements, Ron D’Hondt, Celestica
• Material Declaration:  Working with Suppliers to do the Right Thing, Eric Austerman, Jabil

Component Supplier/Manufacturer

• Texas Instruments Requirements, Mark Frimann, Texas Instruments
• KEMET Material Declarations, Joel Sherman, KEMET

Bare Board Supplier

• RoHS/WEEE PCB Fabrication Data Transfer Dana Korf, Sanmina-SCI

Emerging Solutions Panel

• RosettaNet Solutions — Material Composition (MatComp): A Comparison Between PIP 2A10 and 2A13, John Cartwright, Intel Corporation
• The Product Data Exchange Standard:  PDX Overview & Adoption, Barbara Goldstein, NIST
• Part Compliance in PDX 2.0 (Proposed), Dries D’hooghe, Agile Software
• International Dictionaries (Interoperability), Dieter Bergman, IPC

Strategy & Architecture for Standards-Based Message Exchange

• RosettaNet Automated Enablement (RAE), John Cartwright, Intel
• RosettaNet Multiple Messaging, Mark Schenecker, E2open

Commercial Solutions

• Agile Software:  Agile Product Governance & Compliance, Dries D’hooghe
• Centor Software Corporation:  Compliance X-Sight Solution
• E2open:  E2open Material Composition Declarations (MCD) for EU RoHS/WEEE Compliance: Multi-Company Process Management
• The GoodBye Chain Group:  RoHS-WEEE.NET Data Exchange Solution, Harvey Stone
• i2: Tony Grzesik
• Oracle: Environmental Governance & Compliance, Hardeep Gulati and John Haddad
• Pacific Oaks Technology:  Content Provider for RoHS/WEEE, Jon Wu
• PTC:  PTC Environmental Regulatory Compliance Solutions, Chad Hawkins
• SAP/Technidata:  Environmental Compliance for Products, Neetin Data and Ingo Sigmund
• Synapsis Technology:  EMARS™ — Environmental Material Aggregation and Reporting Systems, German Avila
• Total Parts Plus:  Rick Cleveland

Tuesday, August 31, 2004

Day One Summary, Day Two Agenda

Lessons Learned from Early Material Exchange Implementations

• JGPSSI Green Procurement (Combined Material Declaration) Status in Japan, Jun Yamaguchi, Fuji Photo Film Co., Ltd. (webcast)
• NEMI Materials Declaration Project Phase 1 Results, Nancy Bolinger, IBM
• Lessons Learned from the End-of-Life Vehicle (ELV) Directive, Chris Harden, MDSMap^SM
• Agilent’s Materials Composition Implementations, Mike Young, Agilent Technologies
• Dell Supplier Declaration Process, Kara Thompson, Dell

Material Composition Declaration Data Exchange Roadmap

• Proposed NEMI Materials Declaration Request and Reporting Format (Excel), Richard Kubin, E2open
• NEMI Materials Declaration Process:  Data Collection Process, JB Hollister, JB Hollister Consulting

Wrap-Up