2009 iNEMI Roadmap - Asian Workshop (July 28; Shanghai, China)

Presentations:  iNEMI China Opening Ceremony and Industry Forum (1/16/08; Pudong, Shanghai, China)

In 2004, NEMI became iNEMI as we made a conscious decision to internationalize the organization.  While our roots are in North America, we are taking the steps necessary to become more inclusive of both Asian and European participants in order to better reflect the global electronics industry.  Toward that end, we opened a representative office in Shanghai in 2007.  This office will provide a regional center to support further collaboration among our members and to help recruit participation from additional companies in the region.

Most iNEMI members have significant operations in China and they formed the iNEMI China Collaboration group in 2004, which has been active since then.  We have established the China Steering Committee, chaired by ZHU Jian (Alcatel Shanghai Bell Co., Ltd.) to facilitate and coordinate all iNEMI technical activities for the region.  Our first regional deployment project is currently being formed — the Solder Paste Deposition Project.  iNEMI will also be looking for opportunities to interface and work closely with other industry associations and consortia in China.

We hope our members in China will get involved - network with other iNEMI members, share best practices, provide input to the roadmap and more.  Through your active participation and feedback, you can help establish the direction of iNEMI's collaborative efforts in order to ensure that the needs of iNEMI members in China are met.

2008 iNEMI China collaboration meetings

    August 25, 2008 (Shenzhen)
    December 12, 2008 (Shanghai)

All member companies are welcome.  For further details, please contact:
     Haley Fu (iNEMI), haley.fu@inemi.org
     ZHU Jian (Alcatel Shanghai Bell Co., Ltd.), jian.h.zhu@alcatel-sbell.com.cn

 Meeting agendas, minutes and presentations

Background information

iNEMI in China (PDF)

iNEMI China organization chart (PDF)

Haley Fu, Manager of Operations, China

Solder Paste Deposition Project (regional deployment project)

Shown here are participants in the September 21, 2007 China collaboration
meeting held at Huawei in Shenzhen.