Organization
Board of Directors
Chairman: Nasser Grayeli, Intel Corporation
Marc Benowitz, Alcatel-Lucent
FEI Xudong (Huawei Technologies Co., Ltd.)
Byung Joon (BJ) Han, STATS ChipPAC Ltd.
Monroe Huang, Delphi Electronics & Safety
Kim Hyland, Cisco Systems, Inc.
Sundar Kamath, Sanmina-SCI
Jean-Luc Pelissier, CBA Group LLC
Rob Shaddock, Tyco Electronics Corporation
Michael Toben, Rohm and Haas (a wholly owned subsidiary of the Dow Chemical Company)
Ex-Officio Board Members:
James (Jim) McElroy, iNEMI
James Olthoff, National Institute of Standards and Technology
Robert C. (Bob) Pfahl Jr., iNEMI
Jie Xue, Cisco Systems, Inc.
Contact information: Board of Directors
Technical Committee
Co-chair: Jie Xue, Cisco Systems, Inc.
Co-chair: Robert C. (Bob) Pfahl Jr., iNEMI
Mulugeta Abtew, Sanmina-SCI Corporation
Mostafa Aghazadeh, Intel Corporation
Bill Barthel, Plexus Corp.
David R. Bender, Tyco Electronics Corporation
Ravi Bhatkal, Cookson Electronics
Mario Bolanos, Texas Instruments Incorporated
Mike Davisson, Agilent Technologies, Inc.
Koen Gieskes, Universal Instruments Corporation
Barbara Goldstein, NIST
Carol Handwerker, Co-chair, iNEMI Research Committee, Purdue University
Sherwin Kahn, Alcatel-Lucent
Sunny Liu, Huawei Technologies Company, Ltd.
Alan Rae, Director of Research and Chair, iNEMI Research Committee, NanoDynamics, Inc.
Michael Roesch, Hewlett-Packard Company
Ravi Subrahmanyan, Micro Systems Engineering, Inc.
Peter Tomaiuolo, Celestica, Inc.
ZHU Jian, Alcatel Shanghai Bell Co., Ltd., Chair, China Steering Committee
Ex-Officio TC Members:
Alan Allan, Intel Corporation
David Godlewski, Manager of Deployment, iNEMI
Chuck Richardson, Director of Roadmapping, iNEMI
Contact information: Technical Committee
Responsibilities/Time Commitment: Technical Committee
Research Committee
Chair: Alan Rae, NanoDynamics, Inc.
Co-chair: Carol Handwerker, Purdue University
Bob Pfahl, Secretary, iNEMI
Mario Bolanos, Texas Instruments Incorporated
Barbara Goldstein, NIST
Bob Hilty, Tyco Electronics Corporation
Voya Markovich, Endicott Interconnect Technologies, Inc. (EIT)
Martin Rausch, Intel Corporation
D.H.R. Sarma, Delphi Electronics & Safety
Rao Tummala, George Institute of Technology
Jie Xue, Cisco Systems, Inc.
Contact information: Research Committee
Responsibilities/Time Commitment: Research Committee
Asia Steering Committee
Chair: ZHU Jian, Alcatel Shanghai Bell Co., Ltd.
Secretary: Haley Fu, iNEMI Manager of Operations, Asia (+86 21 5835 3839, haley.fu@inemi.org)
CAO Xi, Huawei
Su Liang Chan, Delphi Automotive Systems Singapore Pte Ltd.
NK Chari, Agilent Technologies
Simon T.S. Lee, Rohm & Haas
George Lim, Celestica
Pow Wah Lim, Agilent Technologies Microwave Products (Malaysia) Sdn Bhd
Dave Martin, Tyco Electronics
YK Sow, Intel
Contact information: China Steering Committee
Asia Technology Groups
Board Assembly Technologies
Chair: Xiaodong Jiang, Alcatel-Lucent Shanghai Bell Co.
Material and Substrates Technologies
Chair: Simon Lee (Rohm & Haas)
Packaging Technologies
Chair: Mun Leong (ML) Loke, Intel
Test Technologies
Chair: Victor Qiang Chen, Huawei Technologies Co., Ltd.
Contact information: China Technology Groups
Technology Working Groups (TWGs)
Director of Roadmapping: Charles E. (Chuck) Richardson, iNEMI
Contact information: Roadmap TWGs
Responsibilities/Time Commitment: Roadmap TWG Chairs and Co-chairs
Board Assembly
Chair: Dongkai Shangguan, FLEXTRONICS
Co-chair: Ravi Bhatkal, Cookson Electronics
Connectors
Chair: John MacWilliams, consultant
Energy Storage and Conversion Systems
Chair: Open
Co-chair: Randy Malik, IBM
Environmentally Conscious Electronics
Chair: Open
Final Assembly
Chair: John Allen, Celestica
Co-chair: Reijo Tuokko, Tampere University of Technology
Information Management
Chair: Eric Simmon, NIST
Co-chair: Jeff Pettinato, Intel Corporation
Interconnect Substrates - Ceramic
Chair: Howard Imhof, Metalor Technologies
Co-chair: Ton Schless, SIBCO LLC
Interconnect Substrates - Organic
Chair: Jack Fisher, consultant
Co-chair: Henry Utsunomiya, consultant
Mass Data Storage
Chair: Roger F. Hoyt, consultant
Co-chair: Tom Coughlin, Coughlin Associates
Modeling, Simulation & Design Tools
Chair: Yi-Shao Lai, Advanced Semiconductor Engineering, Inc.
Co-chair: SB Park, State University of New York at Binghimton
Optoelectronics
Chair: Dick Otte (PROMEX)
Co-chair: William Ring (WSR Optical Device Solutions LLC)
Organic and Printed Electronics Technology
Chair: Dan Gamota, Motorola
Co-chair: Jan Obrzut, NIST
Co-chair: John Szczech, Motorola Labs
Co-chair: Jie Zhang, Motorola
Packaging
Chair: Bill Bottoms, NanoNexus
Chair: Bill Chen, ASE
Passive Components
Chair: Philip Lessner, KEMET Electronics Corporation
Photovoltaics
Chair: Alain Harrus, Crosslink Capital
RF Components and Subsystems
Chair: Ken Harvey, Teradyne
Co-chair: John Barr, Agilent Technologies
Co-chair: Eric Strid, Cascade Microtech
Semiconductor Technology
Chair: Paolo Gargini, Intel Corporation
Co-chair: Alan Allan, Intel Corporation
Sensors
Chair: Open
Solid State Illumination
Chair: Marc Chaston, Consultant
Test, Inspection & Measurement
Chair: Michael Reagin, Delphi
Co-chair: Michael J. Smith, Teradyne, Inc.
Thermal Management
Chair: Ravi Prasher, Intel Corporation
Product Emulator Groups (PEGs)
Automotive
Chair: Jim Spall, Delphi Electronics
Consumer/Portable Products
Chair: Susan Noe, 3M
Medical Products
Chair: Anthony Primavera, Boston Scientific
Co-chair: Bill Burdick, GE Global Research
Netcom (Network, Data, Telecom)
Chair: John Duffy, Cisco Systems, Inc.
Office/Large Business Systems
Chair: David Copeland, Sun Microsystems
Chair: David Lober, Intel Corporation
Contact information: Roadmap PEGs
Technology Integration Groups (TIGs)
Board Assembly TIG
Chair: Ian Williams, Intel
Board and Systems Manufacturing Test TIG
Chair: Rosa Reinosa, Hewlett-Packard
Co-chair: JJ Grealish, Intel
Environmentally Conscious Electronics TIG
Chair: Open
Medical TIG
Chair: Anthony Primavera, Boston Scientific
Optoelectronics TIG
Chair: Open
Substrates TIG
Chair: Hamid Azimi, Intel
Thermal Management TIG
Co-chair: Vadim Gektin, Sun Microsystems
Co-chair: Je-Young Chang, Intel Corporation
Contact information: TIG Chairs and Co-Chairs
Responsibilities/Time Commitment: TIG Chairs and Co-chairs
Project Leaders
Board Assembly TIG
Board Coplanarity in SMT
Champion: John Davignon, Intel Corporation
Pb-Free Alloy Alternatives
Chair: Greg Henshall, Hewlett-Packard
Co-chair: Stephen Tisdale, Intel
Pb-Free Component and Board Finish Reliability (in conjunction with Substrates TIG)
Chair: Houssam Jomaa, Intel Corporation
Co-chair: Richard Coyle, Alcatel-Lucent
Pb-Free Early Failure Study
Chair: Joe Smetana, Alcatel-Lucent
Pb-Free Nano-Solder Project
Chair: Andrew Skipor, Motorola Labs
Solder Paste Deposition Project
Chair: Shoukai Zhang, Huawei Technologies Co., Ltd.
Warm Assembly Project
Chair: Open
Nano-Attach Project
Chair: Hope Chik, Motorola Labs
Contact information: Board Assembly TIG project leaders
Board and Systems Manufacturing Test TIG
Board Flexure Standardization Project
Chair: Rosa Reinosa, Hewlett-Packard
Co-chair: Alan McAllister, Intel Corporation
Boundary Scan Adoption Project
Chair: Steve Butkovich, Cisco Systems
Functional Test Coverage Assessment Project
Chair: Tony Taylor, Intel
Contact information: Board and Systems Manufacturing Test TIG
Environmentally Conscious Electronics (ECE) TIG
BFR-Free PCB Project - Test Phase (formerly Halogen-Free) (in conjunction with Substrates TIG)
Co-chair: Stephen Tisdale, Intel
High-Reliability RoHS Task Force
Co-chair: Mike Davisson, Agilent Technologies, Inc.
Co-chair: Thilo Sack, Celestica, Inc.
Co-chair: Joe Smetana, Alcatel-Lucent
Pb-Free Rework Optimization Project
Chair: Jasbir Bath, FLEXTRONICS
Co-chair: Craig Hamilton, Celestica
Pb-Free Wave Soldering Project
Chair: Denis Barbini, Vitronics Soltec
Tin Whisker Project - Phase II
Chair: Richard Parker, Delphi
Co-chair: Mark Kwoka, Intersil
Co-chair: Jack McCullen, Intel
Co-chair: John Osenbach, Agere Systems
Contact information: ECE TIG project leaders
Medical TIG
Medical Components Reliability Specifications Project - Test Phase
Chair: Anthony Primavera, Boston Scientific
Co-chair: Scott Zellmer, Micro Systems Engineering, Inc.
Medical Substrates
Chair: Thomas Jacob, Dyconex
Contact information: Medical TIG project leaders
Optoelectronics TIG
Fiber Connector End-Face Inspection Project - Phase II
Chair: Tatiana Berdinskikh, Celestica
Co-chair: Brian Roche, Cisco Systems
Contact information: Optoelectronics TIG project leaders
Substrates TIG
BFR-Free PCB Porject - Test Phase (formerly Halogen-Free) (in conjunction with Substrates TIG)
Co-chair: Stephen Tisdale, Intel
IPC-2581 Industry Adoption Initiative
Chair: Dana Korf, Sanmina-SCI
Pb-Free Component and Board Finish Reliability (in conjunction with Board Assembly TIG)
Chair: Omar Bchir, Intel
Co-chair: Richard Coyle, Alcatel-Lucent
Contact information: Substrates TIG project leaders
Thermal Management TIG
Co-chair: Vadim Gektin, Sun Microsysatems
Co-chair: Je-Young Chang, Intel Corporation
Liquid Cooling Initiative
Chair: Open
Contact information: Thermal Management TIG project leaders
Emerging Initiatives
RFID Item-Level Tag Initiative
Co-chair: Steve Brown, Celestica
Co-chair: Dan Gamota, Motorola
Co-chair: Prasanna Kulkarni, Motorola
Contact information: RFID Item-Level Tag Initiative
Executive Secretariat
Jim McElroy, CEO/Executive Director
603-539-7722, 703-834-2082, jmcelroy@inemi.org)
Robert C. Pfahl Jr., Vice President of Global Operations and Treasurer
(703-834-2083, bob.pfahl@inemi.org)
Chuck Richardson, Director of Roadmapping
(256-880-0922, chuck.richardson@inemi.org)
Cynthia Williams, Director of Communications
(207-871-1260, cwilliams@inemi.org)
David Godlewski, Manager of Deployment
(717-651-0522, dgodlewski@inemi.org)
Haley Fu, Manager of Operations, Asia
(+86 21 5835 3839, haley.fu@inemi.org)
Grace O'Malley, Manager of Operations, Europe
(+353-87-9040-363, gomalley@inemi.org)
Linda Anderson-Jessup, Office Manager
(703-834-2086, linda.jessup@inemi.org)
Dee-Dee Taylor, Office Administrator
(703-834-2087, dtaylor@inemi.org)
Consultants
Jim Arnold, Program Management
David Bruns, Net/Systems Administrator
Christopher B. Hanback, iNEMI Counsel
George Till, Roadmapping
Contact information: Consultants