Projects
iNEMI forms projects to address technology and infrastructure gaps identified through the consortium's roadmapping and gap analysis activities. iNEMI identifies areas: (1) that are not currently being addressed by other industry efforts, and (2) where members can collectively have an impact. Projects aim to eliminate gaps through:
- accelerated deployment of new technology
- development of industry infrastructure
- dissemination of efficient business practices
- stimulation of standards
Projects are organized within Technology Integration Groups (TIGs) and iNEMI membership is usually required for project participation.
Click here to download the latest iNEMI projects booklet, which provides brief descriptions of all projects and initiatives.
Board Assembly TIG
- Pb-Free Nano-Solder
- Warm Assembly
- Nano-Attach
New initiatives:
- Board Coplanarity in SMT
- Pb-Free Alloy Alternatives
- Pb-Free Component & Board Finish Reliability (joint with Substrates TIG)
- Pb-Free Early Failure
- Solder Paste Deposition
Completed projects:
- DPMO (Defective Parts per Million Opportunities)
- Pb-Free BGAs in SnPb Assemblies
- Test Strategy
Board and Systems Manufacturing Test TIG (new)
New initiatives:
- Board Flexure Standardization
- Boundary Scan Adoption
- Functional Test Coverage Assessment
Environmentally Conscious Electronics (ECE) TIG
- BFR-Free: Test Phase (formerly Halogen-Free; joint with Substrates TIG)
- High-Reliability RoHS Task Force
- Pb-Free Rework Optimization
- Pb-Free Wave Soldering
- Tin Whisker, Phase II
New initiatives:
- BFR-Free High-Reliability PCB (joint with Substrates TIG)
Completed projects:
- BFR-Free: Design Phase (formerly Halogen-Free; joint with Substrates TIG)
- Lead-Free Assembly
- Lead-Free Assembly & Rework
- RoHS Transition Task Group
- Assembly Process Specifications
- Component and Board Marking
- Component Supply Chain Readiness
- Materials Declarations
- Tin Whisker Accelerated Test
- Tin Whisker Modeling
- Tin Whisker User Group
Medical TIG
- Medical Components Reliability Specifications
- Medical Substrates
Optoelectronics TIG
- Fiber Connector End-Face Inspection, Phase II
Completed projects:
- Fiber Connector End-Face Inspection
- Fiber Handling
- Fiber Optic Signal Performance
- Fiber Optic Splice Improvement
- Fiber Optic Splice Loss Measurement
- Optoelectronics for Substrates (joint with Substrates TIG)
Product Lifecycle Information Management (PLIM) TIG
Completed projects:
- Materials Composition Data Exchange
Previous Factory Information Systems (FIS) TIG Projects (completed)
- Data Exchange Convergence
- Virtual Factory Information Interchange
- Plug & Play Factory
Substrates TIG
- BFR-Free: Test Phase (formerly Halogen-Free; joint with ECE TIG)
- Pb-Free Component & Board Finish Reliability (joint with Board Assembly TIG)
New initiatives:
- BFR-Free High-Reliabiity PCB (joint with ECE TIG)
Completed projects:
- Advanced Embedded Passives Technology
- BFR-Free PCB: Design Phase (formerly Halogen-Free; joint with ECE TIG)
- High Frequency Material Effects on HDI Formation
- Optoelectronics for Substrates (joint with Optoelectronics TIG)
Thermal Management TIG
New initiatives:
- Liquid Cooling
