Projects
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Web survey on copper wire bonding (please take survey before September 30, 2010)
Statement of Work and Project Statement (PDF files)
Statement of Work (Version 1.1, August 5, 2010)
Project Statement (Version 1.1, August 5, 2010) (initial sign up ends September 10, 2010)
The usage of copper wire has been growing in the industry as the price of gold has increased in recent years. However, the main concerns that would prevent the companies using copper wire technology in the future are in-service reliability, process yield, and unproven historical performance.
This will be a two-phased project. The first phase will focus on collecting information from the industry regarding the key processing and reliability issues pertaining to Cu wire bonding. The second phase of the project will perform necessary experimental work in the areas as defined by Phase 1. The whole project is expected to complete in approximately 12 months from the time of project launch.
This project will:
- Understand key issues and concerns regarding reliability of Cu wire bonding for semiconductors.
- Assess reliability performance of components with Cu bond wires and compare to components with Au bond wires.
- Identify key packaging material properties that impact reliability performance, and provide guidelines on packaging material selection.
- By using a test-to-failure methodology, assess the effectiveness of standard reliability test methods on addressing reliability risks of Cu wire bonded devices.
This project will provide the following benefits to participating companies and the industry in general:
- Reduce the need and efforts for individual member companies to run evaluation on the reliability performance of Cu-wire devices by performing these tasks collectively and sharing data openly.
- Establish potential common requirements on key materials properties for packaging materials so that all component suppliers and users have identical qualification requirements.
- Determine the suitability of using current standard JEDEC test methods and durations for the reliability performance for Cu wire devices. Recommend new testing requirements if the current common practice is found to be inadequate.
Steps for joining the project
On August 5, 2010, the iNEMI Technical Committee approved the SOW and Project Statement, thus beginning the corporate sign-up period for this project. The project will officially begin as soon as two iNEMI members sign the project statement. The period for becoming a founding member for this project will close on September 10, 2010.
For iNEMI members:
- Complete and sign the project statement
- Fax the completed statement(s) to +1 (703) 834-2735 or scan and email to infohelp@inemi.org
For non-members:
For additional information:
Haley Fu
+86 21 5835 3839
haley.fu@inemi.org
