Chair: Ian Williams (Intel Corporation)
Active projects:
- Pb-Free Nano-Solder
- Warm Assembly
- Nano-Attach
New initiatives:
- Board Coplanarity in SMT
- Pb-Free Component & Board Finish Reliability (joint with
the Substrates TIG)
- Pb-Free Early Failure
- Pb-Free Alloy Alternatives
- Solder Paste Deposition
Completed projects:
- DPMO (Defective Parts per Million Opportunities)
- Pb-Free BGAs in SnPb Assemblies
- Test Strategy
