Projects
Teleconferences scheduled for July 9, July 23, August 6, August 20
Proposed project objectives
This group proposes the evaluation of key electrical and mechanical properties, focusing on those attributes that are of greatest value to the supply chain.
• Build on industry knowledge and capability and Phase II (Test) of the iNEMI BFR-Free PCB Project (formerly Halogen-Free)
• Consider unique market segment requirements
• Identify technology readiness and gaps
• Stimulate supply capability
• Determine BFR-free board-level reliability for various components
Presentations
iNEMI BFR-Free PCB Follow-On Project Meeting, Stephen Tisdale (Intel Corporation), April 2, 2008; IPC Circuits Expo, APEX and the Designers Summit 2008 (Las Vegas, Nevada)
iNEMI BFR-Free PCB Follow-On Project Meeting, Stephen Tisdale (Intel Corporation), updated version, April 15, 2008
Project teleconference
This project will hold next teleconference on:
Date: Wednesday, July 9
Time: 4:00 p.m. EDT
Dial-in information:
Toll free: 1-888-238-7805
Toll/International: 1-913-643-4877
Passcode: 777424
Related iNEMI projects
BFR-Free PCB Project: Design Phase (formerly Halogen-Free, Phase I) (completed)
BFR-Free PCB Project: Test Phase (formerly Halogen-Free, Phase II)
For additional information
David Godlewski
iNEMI Staff Manager of Planning
Phone: 717-651-0522
Email: dgodlewski@nemi.org