Chair: John Oldendorf, Intel Corporation

This project was organized to assess and influence readiness of the component supply chain to support RoHS product conversions.  The group surveyed component suppliers in 2004 to determine RoHS content compliance and Pb-free process compatibility, focusing on board-mounted components and PWBs for mainstream electronics and high-reliability applications.  Their objective was to identify areas where industry was at risk of not meeting deadlines for compliance, and to address those areas, either through iNEMI-sponsored efforts or by leveraging ongoing projects from other industry consortia.  The iNEMI survey found that, for all component types, two-thirds of the suppliers surveyed could (at that time) provide Pb-free components that met thermal specifications.  The survey indicated that many manufacturers planned to convert to Pb-free soldering and components in the second or third quarter of 2005, meaning that component suppliers needed to make Pb-free components available in the first or second quarter of 2005.

Statement of Work

Version 1.2 (January 13, 2004)

Presentations

APEX 2004 presentations