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Overview
Board Assembly
Environmentally Conscious Electronics
Thermal Management
Medical
Optoelectronics
Product Lifecycle Information Management
Substrates
Board & Systems Manufacturing Test
Deployment Status Reports
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Projects
Environmentally Conscious Electronics (ECE) TIG

Active projects:
  - BFR-Free PCB: Test Phase (formerly Halogen-Free; joint with the Substrates TIG)
  - High-Reliability RoHS Task Force
  - Pb-Free Rework Optimization 
  - Pb-Free Wave Soldering
  - Tin Whisker, Phase II

New initiatives:
  - BFR-Free High-Reliability PCB (joint with the Substrates TIG)

Completed projects:
  - BFR-Free PCB: Design Phase (formerly Halogen-Free; joint with the Substrates TIG)
  - Lead-Free Assembly
  - Lead-Free Assembly & Rework 
  -
RoHS Transition Task Group 
    -
 Assembly Process Specifications
    - Component and Board Marking
    - Component Supply Chain Readiness
    - Materials Declarations
  - Tin Whisker Accelerated Test
  - Tin Whisker Modeling
  - Tin Whisker User Group