iNEMI

Projects

The work done by the first iNEMI Lead-Free Assembly Project pointed to the need for additional work to evaluate more complex assemblies with thicker boards and to take into consideration the special challenges of Pb-free rework. A follow-on effort -- the iNEMI Lead-Free Assembly & Rework Project -- evaluated thicker boards and the ability to rework a representative mix of components on such boards. Testing began in late 2003 on approximately 100 assemblies, using two board thicknesses (0.093" and 0.135") and a variety of components manufactured with new Pb-free processes. Based on results of its experiments, the project team was able to provide manufacturing environment data to IPC and the JEDECJC-14.1 committee to help evolve J-STD-020B to the current J-STD-020C standard, which raises maximum Pb-free surface mount package body temperature limits to 245C, 250C or 260C, depending on package volume and thickness. The team also provided data and recommendations to rework equipment suppliers, which allowed substantial improvement in machines and processes to meet the future challenges of volume manufacturing of Pb-free/RoHS-compliant assemblies.

The Pb-Free Rework Optimization Project was organized as a follow-on to the Lead-Free Assembly & Rework Project.

FINAL REPORT (June 2005)

Press releases

iNEMI Lead-Free Assembly & Rework Project Reports Results at IPC Printed Circuit Expo/APEX/Designers Summit (2.22.05)

NEMI Launches New Lead-Free Assembly and Rework Project (7.15.02)

Articles & presentations

iNEMI Lead-Free Micro BGA, CBGA, Mictor Connector and Through-Hole PDIP Rework Evaluations, Jasbir Bath (Solectron), Quyen Chu and Nabel Ghalib (Jabil Circuit), Charlie Han and Greg Smith (LACE Technologies), SMTA International, September 28, 2005 paper presentation

Pb-free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies, Jerry Gleason (HP), Charlie Reynolds (IBM), Jasbir Bath (Solectron Corporation), Quyen Chu (Jabil Circuit), Matthew Kelly (formerly Celestica, now at IBM), Ken Lyjak (IBM) and Patrick Roubaud (HP), IEEE ECTC, May 31-June 3 (Lake Buena Vista, FL).

Pb-Free Reflow and Rework (cover story), Matt Kelly (Celestica International), Quyen Chu (Jabil Circuit) and Jasbir Bath (Solectron Corporation), Circuits Assembly, November 2004, pp. 32-35.

Selective Soldering with SN3.9AG0.6CU: Process Development, Ursula G. Marquez and Denis C. Barbini, Vitronics Soltec, Inc.; Richard A. Szymanowski, Celestica, Inc., SMTAI International conference, September 26-30, 2004 (Chicago, IL).

Lead-Free and Tin-Lead Rework Development Activities within the NEMI Lead-Free Assembly and Rework Project, Jasbir Bath and Mike Wageman, Solectron Corporation; Quyen Chu and Nabel Ghalib, Jabil Circuits; Alan Donaldson, Intel Corp.; Jose Matias and Eddie Hernandez, Hewlett-Packard Corp., SMTAI International conference, September 26-30, 2004 (Chicago, IL).

Development of Baseline Lead-free Rework and Assembly Processes for Large Printed Circuit Assemblies, Patrick Roubaud (HP), Jerry Gleason (HP), Charlie Reynolds (IBM), Ken Lyjak (IBM), Matt Kelly (Celestica), Jasbir Bath (Solectron), Second International Conference on Lead Free Electronics, June 21-23, 2004 (Amsterdam).

NEMI Lead-Free Rework Development (Phase 3), Jasbir Bath (Solectron Corporation), 5th IPC/JEDEC International Lead Free Conference, March 17-19, 2004 (San Jose, CA).

"Lead-Free Rework Development at NEMI," Charlie Reynolds and Jerry Gleason (p.19), sidebar to "Rework with Lead-Free Solders (cover story), Circuits Assembly, August 2003, pp. 18-21.