Projects

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Board and Systems Manufacturing Test TIG

Chair: Rosa Reinosa (Hewlett-Packard)
Co-chair: JJ Grealish (Intel Corporation)

New initiatives:
- Board Flexure Standardization Project
- Boundary Scan Adoption Project
- Functional Test Coverage Assessment Project

Presentations: TIG and project meetings held at IPC Circuits Expo, APEX and the Designers Summit (April 1, 2008; Las Vegas, Nevada)