iNEMI Roadmap

Roadmap

Once the roadmap is complete, the Technology Working Groups (TWGs) conduct a thorough gap analysis which then becomes the basis for iNEMI to undertake projects with its member companies to close identified gaps. The consortium's role is not to manufacture products, but to work on the infrastructure needed to manufacture future products using the same general technical and business attributes as the defined virtual products.

Following are examples of issues identified by iNEMI roadmaps and the projects undertaken to address those concerns.

The 1996 roadmap identified underfill as a technology that was hindering implementation of flip chip. Specifically, most underfills in use at that time had unacceptably long flow and cure times. As a result of iNEMI efforts, two member companies brought fast flow, fast cure underfill materials to market. In addition, iNEMI helped prove a new variable frequency microwave curing technique that provided faster cure times and less stress to the die than a thermal cure. And, iNEMI members helped define the parameters for an inline SMT solder paste inspection and control system that would help manufacturers reduce board defects, shorten time to optimum yield, and reduce product costs through elimination of expensive rework. All of these solutions were available commercially by 1998.
The 1994 and 1996 roadmaps found that, to meet user needs, microvia technology should be introduced into manufacturing by 1998. However, at that time, no North American PWB manufacturers were capable of volume production of high-density interconnect (HDI) microvia boards, and projections indicated that the capability would not exist in this region until 2001. Working cooperatively with IPC, iNEMI implemented a series of projects to help stimulate development of microvia capabilities among PWB manufacturers and, by 1998, several North American suppliers could provide volume production of microvia boards.
The 1996 roadmap highlighted the need for improved interoperability on the manufacturing floor. Proprietary, "closed" systems made it a difficult, time-consuming process to integrate new equipment into a production line and prevented manufacturers from "mixing and matching" equipment from various vendors in order to use the best equipment for the job. iNEMI's Plug and Play Factory Project addressed these issues of interoperability and developed a series of standards for factory floor communication which is now part of the IPC 2540 CAMX (Computer Aided Manufacturing using eXtensible Markup Language) standards. By standardizing the language used by assembly placement and test equipment these standards help reduce the amount of time and cost that is takes to integrate a new piece of electronics assembly equipment into a shop floor environment and to start collecting data and controlling that equipment. In addition, because the standards are XML-based, they can be used over the World Wide Web. The Plug and Play standards began the IPC review process in 1998 and were published by IPC in late 2001. For additional information, see the Plug & Play Factory Project.
The 1998 roadmap raised concern about the need to develop lead-free alternatives to the industry-standard tin-lead solder used in most electronics assemblies. Pending legislation in Europe along with strong marketing forces in Japan touting "green" electronics were making lead-free assemblies a must for companies wanting to compete in foreign markets. iNEMI's Lead-Free Assembly Project recommended a lead-free solder as an industry "standard" and conducted extensive testing and evaluation to help industry find solutions for the many issues raised by the migration to lead-free solder. The project made significant strides toward helping industry prepare for elimination of lead by 2004. For additional information, see the Lead-Free Assembly Project.
The 1998 roadmap was the first iNEMI roadmap to consider supply chain issues. As manufacturing becomes more distributed, business practices are becoming as critical to success as technology. In response, iNEMI formed the Virtual Factory Information Interchange Project (VFIIP) to develop standards for improved supply chain communication. The project developed four standards as part of the IPC-2570 series, collectively called the PDX (Product Data eXchange) standards. Three of the standards (IPC-2571, -2576 and -2578) were published by IPC in late 2001. The fourth (IPC-2577) is currently in review. In addition, RosettaNet has integrated the PDX standards into its own Cluster 2 and Cluster 7 Partner Interface Processes® (PIPs®), which relate to distribution and update of production information and to the exchange of technical data for manufacturing. Combined, these XML-based standards describe how PDX will work with other related standards and formats; they facilitate quote, manufacture, configure, test and kit interactions among supply chain partners; and they define how the build history of boards and final assembly are exchanged. These specifications will, for example, enable trading partners to automatically load bill of materials (BOM) information, update and track approvals of engineering change orders (ECOs) and encode approved vendors lists (AVLs) and approved manufacturers lists (AMLs). For additional information, see Virtual Factory Information Interchange Project.
The 2000 roadmap pointed to optoelectronics as a high-growth technology area with significant potential. However, findings also indicated that numerous assembly issues would have to be addressed before optoelectronic components could be used cost-effectively in volume production of electronic systems. During 2001, iNEMI sponsored several forums and workshops that brought industry together to define the needs and challenges to be met for deployment of optoelectronics. By late 2001, iNEMI launched several optoelectronic initiatives relating to assembly automation and fiber handling. For additional information, see the Optoelectronics TIG.