Roadmapping

Impact of NEMI Roadmaps
Current Roadmap
2000 Roadmap

Projects

Board Assembly TIG
      Test Strategy (completed)
      Fiber Optic Splice Improvement
      DPMO (Defective Parts per Million Opportunities)

Environmentally Conscious Electronics (ECE) TIG
      Lead-Free Assembly and Rework
      Tin Whisker Accelerated Test
      Tin Whisker Modeling
      Tin Whisker User Group
      Lead-Free Assembly (completed)
New initiatives:
     RoHS Transition Task Group
     Assembly Process Standards
     Component and Board Marking
     Component Supply Chain Readiness
     Materials Declarations

Product Lifecycle Information Management (PLIM) TIG
     Product Data eXchange (PDX) extensions & updates
_____IPC-2577
_____PDX 2.0
_____Environmental regulations & data exchange
     Previous Factory Information Systems (FIS) projects:
_____Data Exchange Convergence (completed)
_____Virtual Factory Information Interchange (completed)
_____Plug & Play Factory (completed)

Optoelectronics TIG
___Fiber Optic Signal Performance
___Fiber Handling (completed)
New initiatives:
___Optoelectronics for Substrates Study

Substrates TIG
___High Frequency Material Effects on HDI Formation
___Advanced Embedded Passives Technology (completed)
New initiatives:
___Embedded Resistor and Capacitor Testing