Standards
Flip Chip
| Standard |
Description |
Status |
| J-STD-012 |
Implementation of Flip Chip & Chip Scale Technology |
released January 1996; ANSI approved |
| J-STD-026 |
Semiconductor Design Standard for Flip Chip Applications |
released August 1999; ANSI approved |
| J-STD-027 |
Mechanical Outline Standard for Flip Chip or Chip Size Configurations |
interim final |
| J-STD-028 |
Performance Standard for Construction of Flip Chip and Chip Scale Bumps |
released August 1999; ANSI approved |
| J-STD-029 |
Performance and Reliability Test Methods for Flip Chip, Chip Scale, BGA and Other Surface Mount Array Package Applications |
official representative proposal |
| J-STD-030 |
Guideline for Selection, Application of Underfill Material for Flip Chip and Other Micropackages |
working draft |
| J-STD-032 |
Performance Standard for Ball Grid Array Balls |
released 2002 |
These standards, developed jointly with IPC and EIA/JEDEC, provide common specifications for design, construction and test of flip chip. In this way, process yields, reliability and performance criteria can be reproduced in a highly predictable fashion leading to more rapid introduction and acceptance by industry.
IPC specifications (search by standard number)
Microvia
| Standard |
Description |
Status |
| IPC-2315 |
Design Guide for High Density Interconnects and Microvias |
released June 2000; published jointly with the Japan Printed Circuits Association |
| IPC-2226 |
Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures |
official representative proposal |
| IPC-4104 |
Specifications for High-Density Interconnect (HDI) and Microvia Materials |
released May 1999; ANSI approved |
| IPC-6016 |
Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards |
released May 1999; ANSI approved |
This group of standards were the result of a joint project between the IPC's former Interconnection Technology Research Institute (ITRI) and NEMI, with ITRI taking the lead on the development effort. Combined, these standards enable industry to implement microvia technology for broad use. They provide guidelines and detailed information about design, materials and fabrication, and even help manufacturers know what to expect in usage.
IPC specifications (search by standard number)
Embedded Passives
| Standard |
Description |
Status |
| IPC-4902 |
Specification for Materials for Embedded Passive Devices for Printed Boards |
working draft |
| not assigned |
Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures |
in development |
Optoelectronics - Fiber Handling
| Standard |
Description |
Status |
| 8413-1 |
Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing |
released April 2003 |
Developed jointly by IPC and NEMI's Fiber Handling Project, this standard defines standard practices for handling various kinds of optical fiber along with specifications and guidelines to be used in the design of carriers for these fibers in component manufacturing. The objective is not to define a particular carrier design, but to define enough requirements and guidelines to facilitate the use of fiber carriers in fiber optic component manufacturing, particularly in automated or semi-automated processes.
Lead-Free Assembly
| Standard |
Description |
Status |
| J-STANDARD-020B |
Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices |
released July 2002; ANSI approved |
This standard identifies the classification level of non-hermetic (e.g., plastic) solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress and determines what classification level should be used for initial reliability qualification. Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. The original standard (J-STANDARD-020) was revised to cover components to be processed at higher temperatures for lead-free assembly. NEMI's Lead-Free Assembly Project provided input for revision of the standard.
IPC specifications (search by standard number)