Newsletters
MEMBER NEWSLETTER
NOVEMBER 2008
UPCOMING EVENTS
Sign up now for these upcoming events!Click on the links below for further details.
iNEMI Member Briefing & Reception – Penang, Malaysia– November 6, 2008 (at IEMT)
Intel Symposium on Environmentally Friendly Materials – Shanghai, China– November 11-12, 2008 (sponsored by iNEMI)
iNEMI Medical TIG Forum (hosted by U.S. FDA) – Silver Spring, Maryland, USA– November 14, 2008
Sustainability Summit - Update
As reported last month, four proposed projects emerged from the discussions at the September 22-23 summit meeting at Motorola:
- Non-competitive LCAs for ITC products based on a building block approach using assembly emulators
- PVC replacement alternatives
a. LCA comparing PVC versus PVC-free cables
b. Technical evaluation of alternatives
- Establish market for post-consumer plastics as feedstock for “green” products (e.g., polycarbonate, ABS)
- Establish new electronic applications for post-consumer blended plastics (e.g., housings for power supplies)
Two of these proposed efforts are now in exploratory development.
Tom Okrasinski (Alcatel-Lucent) and Todd Myers (Cisco) have volunteered to champion the LCA initiative.
Scott O’Connell (Dell) has volunteered to champion the second initiative: PVC-Replacement Alternatives and has called for a Formation Teleconference. All interested in the topic are invited to participate.
PVC Replacement Alternatives Formation Teleconference
Thursday, November 6, 2008
1:00 – 2:00 p.m. Central Standard Time
Call-in Numbers:
North America: 1-888-864-0817
International: 1-719-234-7889
Participant’s Passcode: 761614
Further details can be found here.
Please notify Bob Pfahl (bob.pfahl@inemi.org) if you are interested in participating in or championing any of the four proposed projects.
DEPLOYMENT
Medical TIG
Medical TIG Forum Scheduled at US FDA
Friday, November 14, 9:30 a.m. – 3:30 p.m., Silver Spring, Maryland
The Medical Technology Integration Group (TIG) has scheduled a forum to present the recommendations they have developed to help the electronics industry ensure reliability of components used in medical products. Hosted by the U.S. Food and Drug Administration (FDA), this meeting is open to industry.
Discussions will focus on the process followed by the Medical Components Reliability Specifications Project to establish a minimum set of requirements for electronic components used in life-critical applications. There will also be a review of the TIG’s validation process, being demonstrated in the Medical Reliability for MLCCs Project, which is determining accelerated life test methods of long-term leakage and break-down failures of multi-layer ceramic capacitors (MLCCs).
The meeting will be held at the FDA’s White Oak Campus, 10903 New Hampshire Avenue, Silver Spring, Maryland 20903, in Building 2, Room F2047E. Click here for a detailed agenda and additional logistics information.
Medical Components Reliability Specifications End-of-Project Webinar
Thursday, November 6, noon EST
This webinar will discuss Phase I results of the Medical Component Reliability Specifications Project. This group’s goal was to leverage industry knowledge to create a minimum set of requirements for electronic components used in life-critical applications. Specific deliverables include:
- Test and extrapolation methodologies
- Sampling population assessment
- Range and conditions of applicability
- Test methodologies and criteria
- Medical grade guidelines
- FMEA of MLCC failures
- Use conditions for life-critical medical components
- Review of existing and related standards and test methods
Click here for additional information about this end-of-project webinar.
2009 iNEMI ROADMAP
The 2009 iNEMI Roadmap development cycle is fast coming to a conclusion as the individual chapters are being completed, edited and formatted for distribution to iNEMI members. The iNEMI staff would again like to thank all of the members participating in this cycle’s roadmap effort. Although the final numbers are not yet determined, we expect that we will again have a truly international roadmap. Judging from the editing that has been done to this point, the general chapter content has also improved. The new chapters on Solid State Illumination, RFID-ILT and Photovoltaics should offer a timely overview on these important emerging technologies.
The next step will be to start gap analysis by the Technical Committee in January and by the TIGs at APEX, leading to the individual TIG’s technical plans and resulting project suggestions for the iNEMI Technical Committee.
We have 20 TWG chapters and 5 PEG chapters this cycle. We expect to meet the December date for shipping copies of the 2009 iNEMI Roadmap to members.
iNEMI ASIA
iNEMI to Host Reception for Members in Penang, Malaysia following the IEMT Conference
November 6, 2008 – Penang, Malaysia; Park Royal Hotel (7:00 – 8:30 p.m.)
iNEMI will hold a reception and briefing for members following the conference. Jim McElroy, CEO of iNEMI, will give a brief presentation about iNEMI and Dr. Haley Fu, Manager of Operations, iNEMI-Asia, will discuss iNEMI activities in Asia. The goal of the meeting is to increase networking among iNEMI members in Malaysia. Click here for additional details and to register.
iNEMI to Sponsor Intel Symposium on Environmentally Friendly Materials
November 11-12, Shanghai, China
The symposium will address ongoing discussions about the elimination of brominated flame retardants (BFRs), chlorinated flame retardants (CFRs) and PVC from electronic products, and the impact this will have on the electronics manufacturing supply chain. The main goals of the symposium are to provide a forum to discuss concerns about BFR/CFR/PVC-free materials, identify opportunities to address these concerns, and continue the process of industry alignment on common solutions to implement these materials.The registration fee is 350 USD / 2,400 RMB. This fee can be paid by credit card or wire transfer. For additional details about the symposium and to register, click here.
iNEMI LEADERSHIP
Bob Pfahl, iNEMI Vice President of Global Operations, has been appointed to the Board on Manufacturing and Engineering Design (BMED) of the National Academy of Science.
Scott O’Connell, Environmental Program Manager for Dell, has accepted the chairmanship of the Environmentally Conscious Electronics Technology Integration Group (TIG). We look forward to his leadership of this important TIG.
IN THE NEWS
Articles
The September 11 issue of Electronic Design features a brief article called “iNEMI Boundary-Scan Adoption Project.” This article is a sidebar to “The Embedded Plan for JTAG Boundary Scan.” To read about the iNEMI project: http://electronicdesign.com/Articles/Index.cfm?ArticleID=19625
Press Releases
iNEMI and US FDA Plan Forum on Component Reliability for Medical Electronics (10/17/08)
iNEMI’s Robert Pfahl Receives Electronics Goes Green 2008+ Award (10/30/08)
iNEMI CALENDAR
Click here for the current calendar.
For more detailed information on the above meetings, please contact Linda Anderson-Jessup at +1 703-834-2086 or linda.jessup@iNEMI.org.
TIG/Project teleconferences are too numerous to list, and change frequently. If you are interested in participating in any of these calls, contact the Project/TIG Chair or David Godlewski (+1 717-651-0522, dgodlewski@iNEMI.org).
iNEMI Website
Be sure to check the iNEMI website regularly for the latest news and information. If you have any comments, questions, suggestions, etc., regarding website content; please contact Cynthia Williams (cwilliams@inemi.org or +1 207-871-1260). For further information on Asian activities, contact Haley Fu (haley.fu@inemi.org) or +86 (21) 58353839.For further information on European activities, contact Grace O’Malley (gomalley@inemi.org).
From the Editor: We hope you will find this Newsletter interesting and informative. Please provide comments to Bob Pfahl at +1 703-834-2083.