iNEMI Session at IMPACT 2012

October 25, 2012 to October 26, 2012

IMPACT 2012 (October 24-26, 2012)
Taipei Nangang Exhibition Hall
Taipei, Taiwan

Theme:  IMPACT, Inspiring Innovation


Invited Keynotes by iNEMI Members

  • October 25, 13:30-14:20
    OEM Material Management – A Changed Engagement Model
    Michael Roesch (Manager, HP)
     
  • October 26, 09:30-10:20
    Supply Chain Innovation & Collaboration: PCB to Packaging to the Cloud
    Mark Brillhart (VP, Technology and Quality, Cisco)

iNEMI Session
October 26
10:30-12:30
Room 504A

  1. 2013 iNEMI Technology Roadmap Highlights, Bill Bader, iNEMI
  2. Thermal Fatigue Results for Low Ag Alloys, William Chao, Cisco
  3. HFR-Free PCB for High Reliability Products, Michael Roesch, HP
  4. Counterfeit Components – Impact & Mitigation, Jeffrey Lee, IST-Integrated Service Technology Inc.
  5. Current and Future Test Solution Strategies, Eugene Lin, Agilent

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iNEMI is calling for your participation in two connector surveys.  The responses to these surveys will help the iNEMI project working groups answer many of the industries questions, identify gaps and will be used to develop a white paper which will be distributed through the iNEMI process. Your response is greatly appreciated.

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iNEMI will offer discounts to member companies who choose to pay their membership fees in advance for the upcoming years.

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iNEMI is conducting an industry wide survey on Boundary Scan with BSDL files.

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