iNEMI Session at IMPACT 2012

October 25, 2012 to October 26, 2012

IMPACT 2012 (October 24-26, 2012)
Taipei Nangang Exhibition Hall
Taipei, Taiwan

Theme:  IMPACT, Inspiring Innovation


Invited Keynotes by iNEMI Members

  • October 25, 13:30-14:20
    OEM Material Management – A Changed Engagement Model
    Michael Roesch (Manager, HP)
     
  • October 26, 09:30-10:20
    Supply Chain Innovation & Collaboration: PCB to Packaging to the Cloud
    Mark Brillhart (VP, Technology and Quality, Cisco)

iNEMI Session
October 26
10:30-12:30
Room 504A

  1. 2013 iNEMI Technology Roadmap Highlights, Bill Bader, iNEMI
  2. Thermal Fatigue Results for Low Ag Alloys, William Chao, Cisco
  3. HFR-Free PCB for High Reliability Products, Michael Roesch, HP
  4. Counterfeit Components – Impact & Mitigation, Jeffrey Lee, IST-Integrated Service Technology Inc.
  5. Current and Future Test Solution Strategies, Eugene Lin, Agilent

Recent News

With more than 1900 pages and 24 chapters, the 2015 iNEMI Roadmap provides a valuable snapshot of the global electronics manufacturing supply chain in the third millennium.

Read more

The 2015 iNEMI Roadmap is full of valuable information and updates about the challenges and opportunities facing the electronics manufacturing industry over the next 10 years. It provides direction on what technologies are going to be required to meet the ever-evolving needs of the rapidly diversifying and growing applications for electronics.

Read more

This industry webinar reviews highlights from the 2015 iNEMI Roadmap.

Read more

Former iNEMI Chairman Nasser Grayeli is set to receive the 2015 IEEE Components, Packaging and Manufacturing Technology Award at ECTC 2015.

Read more

iNEMI members can now download the 2015 iNEMI Roadmap.

Read more

Members of the iNEMI Board of Directors talk about their experiences with iNEMI and the advantages of membership.

Read more
X
Loading