iNEMI Session at IMPACT 2012

October 25, 2012 to October 26, 2012

IMPACT 2012 (October 24-26, 2012)
Taipei Nangang Exhibition Hall
Taipei, Taiwan

Theme:  IMPACT, Inspiring Innovation


Invited Keynotes by iNEMI Members

  • October 25, 13:30-14:20
    OEM Material Management – A Changed Engagement Model
    Michael Roesch (Manager, HP)
     
  • October 26, 09:30-10:20
    Supply Chain Innovation & Collaboration: PCB to Packaging to the Cloud
    Mark Brillhart (VP, Technology and Quality, Cisco)

iNEMI Session
October 26
10:30-12:30
Room 504A

  1. 2013 iNEMI Technology Roadmap Highlights, Bill Bader, iNEMI
  2. Thermal Fatigue Results for Low Ag Alloys, William Chao, Cisco
  3. HFR-Free PCB for High Reliability Products, Michael Roesch, HP
  4. Counterfeit Components – Impact & Mitigation, Jeffrey Lee, IST-Integrated Service Technology Inc.
  5. Current and Future Test Solution Strategies, Eugene Lin, Agilent

Recent News

Sign-up by October 31.

Two call for participation calls will be held:  September 15 (US/Europe) and September 17 (Asia).

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Sign-up by October 17.

The objective of this project is to investigate the impact of contamination and synthetic defects on optical performance (transmitted power) of expanded beam optical connectors.

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As part of iNEMI's support of sustainability work in the electronics manufacturing industry, iNEMI hosted a webinar to review IEEE 1874 – Standard for Documentation Schema for Repair and Assembly of Electronic Devices:

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iNEMI will offer discounts to member companies who choose to pay their membership fees in advance for the upcoming years.

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