Council of Members

Each Participating Member has a representative on the iNEMI Council of Members. This group elects the Board of Directors, receives information about project and program proposals and status, and provides representatives to the various technology groups.

iNEMI holds one Council meeting each year — ususally in the spring — which is open to everyone within our member companies. These meetings are used to provide an update about current and future iNEMI activities.

iNEMI also holds regional member briefings to update our members.

 

iNEMI Member Meeting, hosted by Intel Japan (Tsukuba, Japan; August 7, 2015) (members only — requires account log-in; create account now)

 

iNEMI Member Meeting, held at APEX 2015 (San Diego, California; February 25, 2015) (members only — requires account log-in; create account now)


iNEMI Member Meeting
, hosted by Dow Chemical (Taipei, Taiwan; October 21, 2014) (members only — requires account log-in; create account now)


Spring Member Meeting and Webinar

Hosted by Intel; Chandler, Arizona; April 9, 2014
Presentations (members only — requires account log-in; create account now)


iNEMI Member Briefing
, hosted by imec (Eindhoven, The Netherlands; June 11, 2013) (members only — requires account log-in; create account now)

iNEMI Member Briefing (Taiwan; April 18, 2013) (members only — requires account log-in; create account now)


Spring Member Meeting and Webinar

April 2, 2013
Presentations (members only — requires account log-in; create account now)

Special Session from University of California, Berkeley

  • Green Product Design & Manufacturing - Dave Dornfeld, Chair of Mechanical Engineering Dept, UC Berkeley
  • Berkeley Sensor & Actuator Center - John Huggins, Interdisciplinary University/Industry Research
  • Harsh Environment Sensing/Networking - Albert P. Pisano, Professor of Mechanical Engineering, UC Berkeley
  • Manufacturing Solutions & Roadmap for the Trillion Sensor Universe - Janusz Bryzek, Fairchild

Spring Council Meeting and Webinar
April 11, 2012
Presentations (members only — requires account log-in; create account now)

Special Session on Packaging/Miniaturization

  • Future of Packaging and Georgia Tech Programs to Overcome the Two Gaps, Prof. Rao Tummala (Georgia Tech)
  • Technical and Investments Challenges in Packaging, Lee Smith (Amkor)
  • Adhesion of Interfaces and Thermo Mechanical Reliability, Prof. Reinhold Dauskardt (Stanford)
  • Next Generation Packaging Substrate Technology, Hamid Azimi (Intel)


Fall Council Meeting (Webinar)

October 4, 2011
Presentations (members only — requires account log-in; create account now)
Project updates include:

  • Counterfeit Components (new initiative)
  • Copper Wire Bonding
  • HFR-Free Signal Integrity 
  • PVC-Free Alternatives
Enter list of recipients separated by commas: User names, Email addresses

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