To develop recommendations to update IPC/JEDEC 9704 to reflect current best practices in strain gage technologies and measurement techniques.
Statement of Work and Project Statement (PDF files)
Board Flexure Standardization, Phase 2 (Guidelines for Printed Wiring Board Strain Gage Testing in Pb-Free Assemblies)
- Statement of Work (Version 2.1; July 19, 2010)
- Project Statement (Version 2.1; July 19, 2010) (initial sign up ended September 10, 2010)
For Additional Information