Board Flexure Standardization, Phase 2

End-of-Project Webinar

This iNEMI member only webinar was held on August 4 (U.S.) and August 5 (Asia).  Recording of the webinar.

Project Objective

To develop recommendations to update IPC/JEDEC 9704 to reflect current best practices in strain gage technologies and measurement techniques.

Statement of Work and Project Statement (PDF files)

Board Flexure Standardization, Phase 2 (Guidelines for Printed Wiring Board Strain Gage Testing in Pb-Free Assemblies)

For Additional Information

David Godlewski
+1 717-651-0522
dgodlewski@inemi.org

 

Chair: Elizabeth Benedetto, HP
Co-chair: Radhakrishnan Jagadeesh, Intel

iNEMI Members

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