Project Webinars and Reports (MEMBERS ONLY)

Project Webinars

Alternative Materials, June 26, 2014

Repair & Recycling Metrics, June 25, 2014

Boundary Scan, Phase 2 (May 7, 2014)

Built-In Self-Test (BIST), Phase 3 (May 7, 2014)

Qualification Test Development for Creep Corrosion, Phase 1 (April 21, 2014)

Copper Wire Bonding, Phase 2 (March 27, 2014)

Qualification Methods for Portable Medical Products (March 27, 2014)

Component Specifications for Medical Products (March 25, 2014)

Pb-Free Rework Optimization, Phase 3 (March 12, 2014) (available to both members and non-members)

PCBA Reliability Qualification (February 27-28, 2014) (available to both members and non-members)

Improving UL Certification of Laminates and Printed Circuit Boards (November 20, 2013)

Counterfeit Components (October 15, 2013)

Wiring Density for Organic Packaging Substrates (December 6, 2012)

Connector Particle Thickness Investigation (December 4, 2012)

Creep Corrosion, Phase 3 (November 5-6, 2012)

PVC Alternatives, Phase 1 (September 12, 2012)

Eco-Impact Evaluator, Phase 2 (LCA Estimator for ICT Products) (October 17, 2012)

HFR-Free High Reliability PCB Project (October 4, 2012); Recording

Structural Test of External Memory Devices (Boundary Scan Adoption Project, Phase 2) (May 24, 2012)

HFR-Free PCB Materials (February 21, 2012)

Built-In Self-Test (BIST), Phase 2 (December 14, 2011), Recording

Board Coplanarty in SMT (August 23, 2011)

Board Flexure Standardization (August 4-5, 2011), Recording

Eco-Impact Evaluator for ICT Equipment (December 3, 2010)

Pb-Free Wave Soldering, Phase 2 (October 14, 2010)

Solder Paste Deposition, Phase 1 (October 13-14, 2010)

Built-In Self-Test (BIST), Phase 1 (July 14 2010)

Medical Reliability for MLCCs (Multi-Layer Ceramic Capacitors) Project (March 31, 2010)

Board Flexure Standardization Project  (January 20, 2010)

Boundary Scan Adoption Project (October 20, 2009)

Functional Test Coverage Assessment (August 12, 2009)

iNEMI Lead-Free Rework Optimization, Phases 1 and 2 (August 5, 2009)

Tin Whisker Accelerated Test Project Phases 1-5 (June 10, 2009)

Fiber Connector Endface Inspection Project Phase 2 (March 23, 2009)

Nano-Solder Project (February 4, 2009)

Nano-Attach Project (December 17, 2008)

Medical Components Reliability Specifications Project (November 6, 2008)

BFR-Free PCB Material Evaluation Project (September 17, 2008)

Pb-Free BGAs in SnPb Assembly Process Project (August 28, 2008)

Pb-Free Wave Soldering Project Phase 1 (October 4, 2007)

Pb-Free BGAs in SnPb Assemblies Project Phase II (October 4, 2007)

Fiber Connector End-Face Inspection (January 24, 2007)

Materials Composition Data Exchange Project (December 8, 2005)

Lead-Free Assembly & Rework Project (April 4, 2005)

DPMO Project (February 16, 2005)

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Final Reports

Evaluation of Pb-Free Component & Board Finish Reliability (December 19, 2012)

PVC Alternatives Interim Report (November 30, 2010)

iNEMI Tin Whisker Team End-of-Program Report, Richard Parker (Delphi), presented at iNEMI Fall Council meeting (October 28 2010; Orlando, Florida)

Rare Earth Metals Survey Summary (August 23 2010)

iNEMI Whitepaper on Life Cycle Assessment (LCA) for the Information and Communications Technologies (ICT) Sector (April 2010)

BFR-Free PCB Project- Phase II (Material Evaluation) (August 8, 2008)

Pb-Free BGAs in SnPb Assembly Process Project (August 28, 2008)

2006 iNEMI Optoelectronic Substrates Project Report (November 2, 2006)

Lead-Free Assembly & Rework Project (June 2005)

Lead-Free Assembly Project (December 2003)

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Recent News

iNEMI has scheduled interim progress reports for 3 of its environmental projects.

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iNEMI has hired a new manager for our European operations.

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iNEMI is following up on workshop held in Toyama, Japan in April 2014.

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Webinars will be held week of June 23.  Sign up for two new connector projects by July 18, 2014.

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iNEMI is conducting an industry wide survey on Boundary Scan with BSDL files.

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