Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards. This trend has led to warpage issues in the surface mount assembly process which, in turn, impacts PCB assembly yield. iNEMI is organizing a project that will help to explore three key factors (PCB fabrication process, PCB design and board assembly process conditions) and develop guidelines for each of these factors to help minimize PCB warpage and improve SMT margin/yield.
This paper details a process and methodology which holds promise to substantially improve the economic and resource value recovered by electronics reuse and recycling, using hard disk drives (HDDs) as the case example. The goal is a sustainable circular economy of HDDs, and eventually all electronics, based on efficient and full exploitation of value potentials inherent in the products.
iNEMI webinars on April 6 & 7 provided a "sneak peek" of the 2017 Roadmap with highlights of select roadmap chapters.
(May 3, 2017; Herndon, Virginia)
This presentation provides an introduction to the 2017 iNEMI Roadmap, along with a review of highlights from the Passive Components chapter as well as from the roadmap overall.
This Buzz Session presentation provides an overview of the 2017 iNEMI Roadmap and includes highlights from the IoT Product Sector, Sustainable Electronics and Interconnect Substrates - Organic chapters.
This open meeting reviewed Phase 2 of iNEMI's latest optoelecttonics connector cleanliness project, the recently released Integrated Photonic Systems Roadmap (IPSR) and a joint IPSR-iNEMI project.
This project focused on assessing the processability and reliability of different Pb-free materials available for power semiconductor die-attach applications on leadframe or ceramic substrates that currently use Pb-containing materials.
This presentation from the 2017 IMAPS-UK MicroTech conference discusses trends and challenges in key packaging technologies from the Packaging & Component Substrates chapter of the 2017 iNEMI Roadmap.
This project was organized to assess measurement and inspection capabilities for fine circuit pattern substrates used in high-bandwidth applications. Phase 1 benchmarked the metrology for fine pitch design on panel-sized areas, and the results were discussed in this end-of-project webinar.
This webinar continued the discussions started at the iNEMI forum at Electronics Goes Green. Participants helped identify several needs regarding recycling, eco-design and sustainability, and developed proposals for five potential projects for 2017.
Developing Damage Models for Solder Joints Exposed to Complex Stress States: Influence of Potting, Coating, Mirroring, and Housing on Solder Joint Fatigue
This webinar presents the development of a novel specimen designed to create axial loads in solder joints. Encapsulation materials are used in the specimen as the main axial deformation driver. A modeling approach will be presented based on cracking energy density tested in an effort to fit a damage parameter to TMF life of solder joints in axial loading.
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Presentations and recording from the iNEMI 4th Quarter Member Webinar (October 31/November 1 & November 3). Available to members only.
This end-of-project webinar, held October 28, 2016, reviews the project team’s analysis of the four metrologies used to characterize, measure and present the dynamic warpage of electronic packages as a function of temperature. Their intent was not to declare a best tool but, rather, to provide comparative aspects across the metrologies and tools for those considering a specific use model.
This meeting focused industry discussion on PCB and PCB assembly related technologies. Hosted by Lenovo, it was held in Taipei, Taiwan on October 25, 2016.
The end-of-project webinar for the DC-DC Power Module Project reviewed results of the project team’s work to design and test prototypes of a DC-DC converter to prove out the electrical and mechanical engineering specification requirements developed during Phase 1.
This paper was presented by Steve Payne (iNEMI) at the Automotive Electronic Systems Innovation Network (AESIN) Conference (October 20, 2016; Solihull, UK).
This presentation is from the Medical Electronics Symposium 2016 (September 14-15, Portland, Oregon), co-sponsored by SMTA, iNEMI and MEPTEC.
This paper, presented at SMTA International 2016, describes the planning and progress of iNEMI’s experimental program for evaluating the thermal fatigue performance of a number of third generation alternative Pb-free solder alloys.
This whitepaper by the iNEMI Connector Reliability Test Recommendations Project summarizes the findings of their review of current standards pertaining to connector reliability, defines a multi-level interconnect hierarchy and a matrix of application classes, and discusses possible connector reliability test strategies based on the interconnect hierarchy developed.
This automotive panel roundtable — Miniaturization & System Integration Challenges for Automotive Applications — brought together leaders in the automotive OEM supply chain to discuss trends and the associated packaging solutions for the industry.
The aim of publishing the iNEMI Research Priorities is to facilitate the development of solutions to the identified longer term pre-competitive needs of the electronics industry worldwide. This document presents the consensus on R&D needs identified by the 2015 iNEMI Roadmapping process. This Research Priorities document is intended as a resource for all who are directing R&D funding and execution in the areas of electronics and electronics manufacturing globally.
iNEMI’s PCBA Reliability Qualification Project developed the requirements outlined in this document for the assembly-reliability qualification of printed circuit board assemblies (PCBAs) used in enterprise products. The recommendations establish a common hardware reliability qualification process for computing hardware, and may be used to qualify new aspects of manufacturing and design such as new manufacturing facilities, changes in materials, process, and new design elements.
The Lead-Free Rework Optimization Project used the rework processes developed by previous phases to assemble and rework boards and perform reliability testing to validate the rework processes developed. Part 2 of the end-of-project presentation discusses the results of rework for adjacent components, BGA sockets, mini-pots, PDIPs, and DIMMs.
This whitepaper reviews the status of rare earth metal (REM) supplies (as of 2014), reviews the events that led to a shortage of REMS, and discusses future options for successful management of the REM industry. Specifically, this document discusses the sources of REM ores and processed materials, the technologies that have increased demand, and the political and economic climate that led to the current supply situation. Potential solutions to prevent future supply constraints are identified for further discussion.
This presentation introduces the concept of board-assist (BA-BIST) as enhanced IC BIST functionality for board testability and fault isolation. It discusses the board defects targeted by BA-BIST, the most required BISTs, industry “use cases” for board test BA-BIST, and the relation to existing standards. (Presented at APEX 2014, Las Vegas, Nevada, USA.)
This presentation provides highlights of the iNEMI Packaging Roadmap, including packaging trends. high-performance packaging technologies, and packaging challenges. (2014 High Performance Packaging Workshop, Oxford, England.)
The Reliability Requirements for Implantable Medical Devices Project focused on defining requirements for implantable reliability specifications (specifically, FDA class 3 devices). This paper reports on the project’s review of existing reliability, quality and safety standards specific to implantable electronic devices. It includes the results of an industry survey of commonly used/modified test standards, and makes recommendations regarding test standards to be developed. (ICEP 2015, Kyoto, Japan.)
This keynote presentation reviews 2015 Roadmap highlights from several product sectors (portable/wireless, automotive, medical) plus the MEMS technology chapter. It also discusses examples of collaborative projects and emphasizes the advantages of industry collaboration. (2015 International Conference on Soldering & Reliability, Toronto, Canada)
The Automotive Electronic Material Challenges Project team discusses the dominant failure mechanisms in automotive electronics for selected components and materials. They also analyze the correlation of material properties to specific environmental conditions, identify gaps between standard consumer electronic test methods and typical automotive test conditions, and present their methodology for analysis. (Presented at ICEPT 2015, Changsha, China.)
This presentation highlights information from the 2015 Roadmap, focusing on packaging technology. (Presented at ISMP 2015, Seoul, Korea.)
This presentation gives a complete overview of what iNEMI is, what membership includes and requires, and explains the benefits of joining iNEMI.
This presentation given at SMTA International 2016 provides a preview of highlights from select chapters of the 2017 iNEMI Roadmap — IoT, Board Assembly and Optoelectronics.
This iNEMI research webinar focused on a model developed by Binghamton University to determine the thermal fatigue of lead-free solder joints. Their approach allows for the generalization of observed trends and leads to recommendations for test protocols and guidelines. Presented by Peter Borgesen, PhD, Professor of Systems Science & Industrial Engineering and a member of the Materials Science program at Binghamton University (SUNY).
This iNEMI forum — Recycling electronics alone won’t save the planet (or make you rich) — included presentations from a group of panelists plus open discussion among forum participants. Discussions focused on how the electronics industry might develop a value recovery approach for electronics reuse and recycling. Presentations from the forum panelists are available for download.
Part 1 of the end-of-project presentation of the Lead-Free Rework Optimization Project covers solder joint characterization and reliability. The project evaluated and recommended best practices, rework equipment requirements, impact of adjacent component temperatures and procedures for best practice lead-free rework processing. This presentation discusses details of the accelerated thermal cycling (ATC) test results plus solder joint and plated through hole (pth) copper knee thickness characterization
The Component Specifications for Medical Products Project addressed the lack of industry-wide medical specifications for the qualification of components or their suppliers. This report summarizes the work conducted by this iNEMI project team to identify relevant critical components and then, using a case study of a specific critical component, to assess the level of understanding and technical knowledge needed to develop a relevant specification for that component that would be appropriate for medical devices.
"This whitepaper by iNEMI's Counterfeit Components Project takes a comprehensive view of the counterfeit components problem by surveying the possible points of entry in the supply chain and assessing the impact of counterfeit components on the industry at various points of use. The project team also proposes a risk assessment calculator that can be used to quantify the risks of procuring counterfeit parts.
This presentation discusses the Boundary Scan Project’s investigation into the challenges of using .bdsl files and reports the results of a survey focused on .bsdl file generation, validation, and industry usage. (Presented at APEX 2014, Las Vegas, Nevada, USA.)
This paper by the Metals Recycling Project discusses the state of metals recovery and recycling in the electronics industry.
This paper reports on the findings of the Recycling and Repair Metrics Project’s assessment of the type and quality of metrics available to the electronics industry for measuring an electronic product’s true recyclability, reusability, repairability and refurbish-ability. It also looks at whether existing metrics are adequate to meet the needs of the industry and makes recommendations for changes and further study.
Dynamic warpage trends for package-on-package and its memory, plastic ball grid array and flipped chip ball grid array packages are presented to provide an overview of current industry trends of package warpage. The effect of bake and manufacturing exposure time on package dynamic warpage and the challenges in quantifying shape will be discussed and recommended for future package warpage characterization. (Presented at the 2015 ICEP conference in Kyoto, Japan.)
Based on the 2015 iNEMI Roadmap, this presentation looks at what's happening in the market and in the industry, reviews new technology developments, identifies what is needed for the future, and discusses how collaboration and reduce risk and accelerate transformation. (Presented at the University of Manchester’s Datacentre Transformation Manchester 2015; Manchester, England.)
The iNEMI Creep Corrosion project discusses the flowers-of-sulfur (FOS) based qualification test it developed to determine creep corrosion on printed-circuit boards (PCBs). This paper reviews details of the testing completed and results of several of the test runs. The team is recommending this test be considered by the industry as a qualification test for creep corrosion on PCBs. (Presented at SMTA International 2015, Rosemont, Illinois USA.)