Development Needs for High-Reliability Pb-Free Electronics
Tuesday, 13 November 2007, 13:30 - 17:00
Productronica 2007
Munich Messe, Conference Room A21
Munich, Germany

  

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Meeting Overview

Identify areas where development is required for mission critical applications to convert to Pb-free with acceptable risks in terms of manufacturing and reliability.

Situation Analysis

For companies that participate in industries that require high-reliability/long-service-life products, the rationale for staying with SnPb assembly for the short to mid term is very clear:  in many cases Pb-free technology has not been able to demonstrate the required level of reliable performance for long-life, mission-critical applications.  While it is increasingly obvious that virtually all electronics products will be Pb-free over time, there are a number of knowledge gaps that must be closed before Pb-free reliability can be predicted with the same certainty that SnPb assembly can deliver.  The risks and potential long-term costs associated with this uncertainty to users and producers of these products are too great to ignore.

Objectives

The meeting objectives are to:

  • Review strategy and progress of iNEMI’s high reliability task group related to Pb-free conversion
  • Discuss results of efforts to encourage availability of SnPb compatible BGAs
  • Review identified knowledge gaps for high reliability Pb-free conversion
  • Review progress to date on collaboration to close gaps
  • Identify opportunities for increasing European involvement in these member projects

Who should attend

  • Industrial Technical Managers responsible for Pb-free technology at high reliability firms
  • Engineers interested in learning about the identified high rel. knowledge gaps and the efforts to close them
  • Marketing and Technology Managers from EMS and supplier firms that support high reliability segments

Preliminary Agenda

 13:30         Welcome / Introductions        Jim McElroy, CEO, iNEMI 

 13:40   
 iNEMI Overview
 

 13:55  
 iNEMI High-Reliability Task Group          
 

 14:10 
 Availability of SnPb Compatible BGAs		  
 

 14:30 
 Prioritization of Knowledge Gaps		  
 

 14:50 
 Break		  
 

 15:10 
 Pb-Free Early Failure Study		  
 
 
 15:25
 Pb-Free Alloy Alternatives		  

 15:40
 SAC BGAs in an SnPb Assembly Process		  

 16:20
 Discussion		  

 16:50
 Wrap-Up		  

Registration and additional information
Registration is free, but we ask that you register in advance to help us with our planning.

Click here to register

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For additional information, please contact Jim McElroy, iNEMI at 1-703-834-2082, jmcelroy@inemi.org