Chair: Stephen Tisdale (Intel Corporation)

Statement of Work and Project Statements for Sign-Up

Statement of Work:  iNEMI HFR-Free Technology Leadership Program (Version 5.0; May 15, 2009)

Project Statement:  HFR-Free PCB Materials Project (Version 5.0; May 15, 2009) (Initial sign-up ends June 29, 2009)

Project Statement:  HFR-Free Signal Integrity Project (Version 5.0; May 15, 2009) (Initial sign-up ends June 29, 2009)

Please fill out and sign Project Statement(s) above and fax to +1 703-834-2735 or email to infohelp@inemi.org.

Click here for presentations from the April 15 meeting in Taiwan

Several major OEMs are evaluating a conversion to HFR (halogenated flame retardant)-free PCB materials.  While mobile phone manufacturers are well along in this effort, the next area of impact will likely be driven by high-volume consumer computer applications.

An industry-wide conversion to HFR-free materials faces numerous challenges:

• Reliability of materials with alternative flame retardants has not been fully qualified.
• Complete "technology envelopes" or technical specifications have not been established for various product applications.
• Incomplete design knowledge in segments of the supply chain increases risk of conversion issues.
• A rapid complete conversion of computer products will have a major impact on the supply chain and needs to be coordinated.

• What electrical properties are needed to meet high-speed signaling requirements?
• With many HFR-free materials showing higher stiffness, what mechanical properties are needed to ensure system reliability isn't degraded?
• Can design modifications reduce sensitivity to electrical and material properties?

• HFR-Free Signal Integrity Initiative
  Chair: Steve Hall (Intel), Co-chair: David Senk (Cisco)
  

• HFR-Free PCB Material Development Initiative
  Chair: John Davignon (Intel)
  

These two initiatives are meeting bi-weekly to generate Statements of Work (SOWs) and Project Statements (PSes).

Upcoming meetings & teleconferences

Press releases