
INDUSTRY EVENT ALERT
NCMS TO UNVEIL ADVANCED EMBEDDED PASSIVES TECHNOLOGY
Consortium to Deliver AEPT Solution to the Microelectronics Industry for
Developing High-Density and High-Performance Products
Press contact at bottom of page
WHAT:
The National Center for Manufacturing Sciences (NCMS) will unveil the ideal model for combining materials, design and processing technologies for embedding passive devices into circuit board substrates at its AEPT Seminar. These advanced embedded passives technologies will enable microelectronics manufacturers to economically attain significant performance improvements, reductions in space requirements and reliability improvement in circuit boards. The breakthrough findings to be made public for the first time are the result of a collaborative research project spearheaded by NCMS and co-funded by industry and the National Institute of Standards and Technology.
WHAT THE FINDINGS DELIVER:
AGENDA:
WHEN/WHERE:
January 30, 2003, 8:00 a.m. - 5:00 p.m.
3M Innovation Center
6801 River Place Blvd.
Austin, Texas
REGISTRATION:
Online: www.ncms.org (see rotating registration information at the top of the home page, center column)
Call: Beth Bolog at NCMS, (734) 995-7962
Registration Fee: $75.00
Lee Patch, Program Manager
(734) 995-4972; leep@ncms.org
http://aept.ncms.org/