Automotive Panel Roundtable: Miniaturization & System Integration Challenges for Automotive Applications

The demand for increased electronics content in the automotive segment is presenting new challenges for the automotive supply chain and vehicle manufacturers. In order to fully leverage the benefits of system integration, new packaging solutions are now being employed throughout the vehicle. This roundtable discussion at the 2016 Electronics System-Integration Technology Conference (ESTC) brought together some of the leaders in the automotive OEM supply chain to discuss the trends and the associated packaging solutions for the industry. Download presentations from this session.

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Presentations from ESTC 2016 Automotive Panel