The iNEMI roadmap is a global collaborative effort that involves many individuals who are leading experts in their respective fields and represent many perspectives on the electronics manufacturing supply chain. For the 2017 Roadmap, more than 500 individuals from at least 22 countries, and representing more than 350 corporations, consortia, government agencies and universities were involved.
The roadmap’s usefulness reaches far beyond iNEMI and our members. It is recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies. It is used by industry, government funding agencies and university research programs to help prioritize R&D efforts for the greatest return on investment.
iNEMI membership is not required to be involved with the roadmap. In fact, the more diversified the representatives working on the roadmap, the broader the reach and the more valuable to the industry. iNEMI solicits input from industry experts representing all aspects of the global electronics manufacturing supply chain.
Efforts are organized into Product Emulator Groups (PEGs) and Technology Working Groups (TWGs), as listed below. Download a description of what each chapter covers.
- Board Assembly
- Ceramic Interconnect & Photovoltaics
- Flexible Hybrid Electronics
- Organic PCB
- Mass Data Storage
- MEMS & Sensors
- Modeling, Simulation & Design Tools
- Packaging & Component Substrates
- Passive Components
- Power Conversion Electronics
- Semiconductor Technology
- Smart Manufacturing*
- Sustainable Electronics
- Thermal Management
* new for 2019
iNEMI members: if you were unable to attend any of the regional roadmap webinars that reviewed work in progress on the 2019 Roadmap and would like to review the materials from those meetings, presentations and links to the webinar recordings are available online. Click here to access (requires member log-in).
Chapter contributors gain in-depth insights into their subject matter by being involved in development of their respective chapters. Chapter contributors will receive a copy of the chapter they worked on ($500 value).
Most PEG and TWG meetings are conducted over the phone or Internet, minimizing the need for travel. Face-to-face meetings are scheduled in conjunction with major industry conferences and meetings, allowing participants to justify their travel plans around both.
Conference calls for all chapter groups are typically 1-2 times per month for 1-2 hours. At the end of the cycle (last few weeks), groups may meet more frequently as the chapter is assembled.
Primary Chair and Co-Chair Roles
Join other industry leaders in subscribing to the 2019 Roadmap Newsletter.