2023 Tech Topic Webinars

Click on the webinar titles below to download a PDF of the presentations, which (in most cases) include a link to the recorded webinar.

Advanced Packaging Series

(All of the following presentations are for iNEMI members only and require log-in, unless otherwise noted.)

• Evolution of Power Packaging: Assembly and Thermal Interface Materials, Andy Mackie, PhD (Indium Corporation), March 28, 2023       Presentation          Recording ​

• Material Trends in Fan-out WLP and PLP, Tanja Braun (Fraunhofer IZM), May 16, 2023

• A View on State-of-the-Art Lithography for Advanced Packaging, Jorge P. Fernandez, Ph.D. (Applied Materials), June 20, 2023

• Challenges and Solutions for AI Servers with Substrate Sizes Greater than 100x100mm, Dr. Dyi Chung Hu (SiPlus Co.), July 19, 2023

• Toward the Physical Reliability of 3D-Integrated Systems, Yaw Obeng, National Institute of Standards and Technology (NIST), September 26, 2023  (presentation is available to the public)

• Photonics Systems for High Performance, Dr. Tolga Tekin (Fraunhofer IZM), October 31, 2023  

• LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design, Kazunari Koga (Zuken Inc.), November 28, 2023 

Counterfeit Components Series

• Series Overview
   
• Counterfeit Components #1: Size and Breadth of Counterfeit Risks (October 19, 2023)
  • Counterfeit Risk Runs Throughout the End-to-End Supply Chain, Ben German (Intel)
  • ​Size and Breadth of the Problem, Michelle Lam (IBM)
  • Onshoring Advanced Packaging and the Impact on Counterfeiting, Charles Woychik (SkyWater Technology)

• Counterfeit Components #2: Counterfeit Management and Best Practices (November 7, 2023)
  • Counterfeit Avoidance and Detection: An Overview of SAE Standards, Michael Azarian, PhD (CALCE, University of Maryland)
  • Counterfeit Reporting Trends 2022, Richard Smith (ERAI)
  • Counterfeit Materials vs. Sustainable Business Models, Michael Ford (Aegis Software)
     
• Counterfeit Components #3: Emerging Trends in Counterfeit Detection and Mitigation  (December 7, 2023)    
  • Understanding Counterfeit Electronics Detection and Mitigation, Navid Asadi (University of Florida)
  • iNEMI Roadmap: Data for Material Handling and Conversion, Francis Mullany, PhD (iNEMI)  
  • Results of iNEMI survey regarding industry experiences with counterfeit components and strategies used to mitigate risk, Paul Hale (NIST), Ben German (Intel Corporation) and Mark Schaffer, moderator (iNEMI)

Low-Temperature Solder Series

• Electromigration in Tin-Bismuth Planar Solder Joints, Prabjit Singh, PhD (IBM), October 17/18, 2023    
   

Smart Manufacturing Series

• Discover the Evolving A.I. Powered Solution towards Smart Manufacturing, Piet Gek Tan (Vitrox), February 15/16, 2023  

• Transforming Electronics Manufacturing Inspection with Vision AI, Arif Virani and Bart Piwowar (DarwinAI), May 16, 2023

• Supercharge the Industrial Workforce with Domain Knowledge and Generative AI, Dr. Roshan Nanu (Aitomatic ), July 12 & 13, 2023

 

Sustainable Electronics Technology Integration Group (TIG) Series

• Autonomous Industrial Monitoring — Vertical Farming and Beyond, Tom Okrasinski (Nokia Bell Labs), January 11, 2023
  
  
• Standards for a Circular Economy and Product Design, KC Norris and Vincenzo Ferrero (NIST), April 5, 2023     (recording, but no presentation available; iNEMI members only)
  
  
• PFAS Overview, Suhani Chitalia and Kelly Scanlon (IPC Global Government Relations), May 3, 2023 (members only; requires log-in) 
  
  
• Why Now for LCAs in Electronics, Philip Smoller and Vagais Hussai (Makersite), June 7, 2023