Richard is a well-recognized industry expert in solder joint reliability, particularly for lead-free solder and temperature cycling of board assemblies. He has chaired four INEMI projects in this area over the past 10 years and participated in at least nine additional projects during this time, spanning many areas of component and assembly reliability. His leadership and active participation in INEMI projects dates back even farther to at least 2006. Over this period of more than 15 years, Richard has co-authored more than 40 conference and journal papers highlighting INEMI project results. He has published additional technical papers (totaling 75 ) documenting other industry projects, academic collaborations and company-specific investigations. In the past four years, five of Richard’s publications have received SMTA International Best of Proceedings recognition, including three publications documenting INEMI projects.
Richard has served on the INEMI Board of Directors since 2018, providing technical oversight and executive guidance to the organization.