Prabjit (PJ) Singh
Senior Technical Staff Member
IBM Corporation

Prabjit Singh has led three major multi-phase INEMI projects in which the teams have made major technically innovative contributions to the electronic manufacturing industry. These innovations have helped companies reduce production time, improve quality and reliability and/or reduce costs. Results of each of these efforts are well-documented in dozens of conference publications.

Creep Corrosion

• FOS Chamber — Developed the INEMI flowers-of-sulfur chamber as a low-cost, effective alternative to the very expensive and hard-to-maintain mixed flowing gas (MFG) chamber used to test electronic assemblies for robustness against corrosion in the field.  A dozen companies are using the INEMI flowers-of-sulfur test chambers. 
• Creep Corrosion Test — Invented and developed a reliable test for creep corrosion using the INEMI FOS chamber that can be completed in less than two weeks to ensure that the PCB supply is free of PCBs that would suffer creep corrosion in the field.

Conformal Coating Test

Invented and developed a test for characterizing conformal coatings using planer serpentine silver and copper thin films. The advantage of the test is that the results are quantitative in nature and the test duration is less than a week compared to the industry’s present test that is qualitative and takes nearly a year to complete. INEMI recognized Phase 1 of the Conformal Coating Evaluation for Improved Environmental Protection Project with a Project Leadership Award in 2022.

Electromigration of SnBi Solder for Second-Level Interconnect

Invented and developed a novel planar solder test specimen for studying electromigration in low-temperature solders such as SnBi.  The novelty of the test is that the specimens are easy to prepare and the progress of electromigration can be non-destructively tracked without having to cross-section the solder joints. Arrhenius plots have been determined to predict the electromigration life of solder joints under field conditions.