Characterization of Third Generation High-Reliability Pb-Free Alloys
Richard Coyle, Alcatel-Lucent
This initiative is a follow-on to the Pb-Free Alloy Alternatives and Characterization of Pb-Free Alloy Alternatives, Phase 1
projects. The project team is now working on characterization of Pb-free alloy alternatives, with two main thrusts:
These requirements and recommended testing methods will be proposed to the IPC Solder Products Value Council to consider for standardization.
Statement of Work
Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony, presented by Richard Coyle, Ph.D. (Nokia Bell Labs), originally published in the Proceedings of SMTA International, September 28 - October 23, 2020.
"Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder Alloys", presented by Richard Coyle (Nokia Bell Labs), SMTA International, September 26, 2019; Rosemont, Illinois.
Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys, presented by Richard Coyle (Nokia Bell Labs), SMTA International, October 18, 2018 (Rosemont, Illinois)