Advancing Manufacturing Technology

Characterization of Third Generation High-Reliability Pb-Free Alloys


Project Leader:
Richard Coyle, Alcatel-Lucent


 

Background

This initiative is a follow-on to the Pb-Free Alloy Alternatives and Characterization of Pb-Free Alloy Alternatives, Phase 1
projects. The project team is now working on characterization of Pb-free alloy alternatives, with two main thrusts:
  • The first is to characterize the thermal fatigue and acceleration behavior of alternative alloys through accelerated thermal cycle testing.
  • The second is to develop a set of test data requirements that will allow OEMs and others to evaluate alloy properties against their requirements.
These requirements and recommended testing methods will be proposed to the IPC Solder Products Value Council to consider for standardization.

Statement of Work

Presentations

Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony, presented by Richard Coyle, Ph.D. (Nokia Bell Labs), originally published in the Proceedings of SMTA International, September 28 - October 23, 2020.

"Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder Alloys", presented by Richard Coyle (Nokia Bell Labs), SMTA International, September 26, 2019; Rosemont, Illinois. 

NEMI Pb-Free Alloy Characterization Papers at SMTA 2012 (as originally published in the 2012 SMTA International Conference Proceedings).

Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys; presented by Richard Coyle (Nokia Bell Labs), SMTA International, October 18, 2018 (Rosemont, Illinois)
NOTE: this presentation was recognized as Best of Proceedings by SMTA.

The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys; presented by Richard Coyle (Nokia Bell Labs), SMTA International, October 18, 2018 (Rosemont, Illinois)