Impact of Low CTE Mold Compound on Second-Level Board Reliability Project, Phase 2
Section: Packaging


Project Leader


Richard Coyle, Nokia Bell Labs
 

Statement of Work & Project Statement


Background

Phase 1 focused on collecting data from the project team and industry regarding reliability issues associated with the transition to lower CTE mold materials. The detailed experiment design and FEM approach for Phase 2 will be optimized based on the input and results from Phase 1.


Contact

Grace O'Malley
gomalley@inemi.org