5G/6G MAESTRO

Section: 5G/6G MAESTRO

Urmi Ray (iNEMI), Principal Investigator (urmi.ray@inemi.org)

Funding
iNEMI was awarded $290,865 from the National Institute of Standards and Technology’s (NIST’s) Advanced Manufacturing Technology Roadmap (MFGTech) Program under the NIST Office of Advanced Manufacturing (Federal ID number: 70NANB22H050).
iNEMI is one of seven organizations receiving MFGTech grants totaling $2.08 million to develop manufacturing technology roadmaps to strengthen U.S. innovation and productivity across entire industry sectors.

Other Industry Roadmaps

NIST Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap / Semiconductor Research Corporation (SRC)

Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP) / UCLA / SEMI

IEEE Heterogeneous Integration Roadmap

iNEMI Roadmap

Roadmap Focus

iNEMI, along with several industry and academic partners, is developing the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO) as part of the NIST Advanced Manufacturing Technology (MfgTech) Roadmap. The goal is to create a foundation of knowledge and expertise in the U.S. to support the development and manufacturing of leading edge 5G and 6G products.

MAESTRO will be a comprehensive 10-year hardware roadmap for mmWave materials characterization and testing. It will focus on the top two gaps in 5G materials development and testing as defined in various industry reports: high-speed/ultra-low loss materials (availability, testing and characterization) and electrical testing and standardization. The technology scope includes:

Characterization
Materials development
Electrical test
Manufacturing scale-up
Workforce development

This 18-month roadmapping project that began on May 1, 2022 and will be completed by September 30, 2023.

Roadmap Partners

A cross-functional team of partners brings together large and small manufacturers, materials companies, university-based research institutions, and consortia to ensure that the roadmap accurately captures technology requirements over the next 15 years and reflects the views of all stakeholders.

3DGS	Florida International University	Nantero
3M	Georgia Institute of Technology	NIST
AMD	IBM	Nokia
Applied Materials	iNEMI	Penn State University
Arizona State University	Intel	Qorvo
Binghamton University	Keysight Technologies	QWED
Colorado School of Mines	ITRI	SunRay Scientific
Dow	liloTree	TechSearch International
DuPont	Mosaic Microsystems	Zestron America

Publications & Reports

Roadmaps	xxxxxxxxxxxxx	MAESTRO Presentations (Workshops & Webinars)
Low Loss Dielectric Materials Characterization Roadmap (April 2023)		5G/6G MAESTRO Workshop: Next-Generation Materials & Testing Needs and mmWave System Design & Analysis (February 9, 2023)
Materials Development & Electrical Test (in development)		5G/6G mmWave Materials & Electrical Test Technology Roadmap Workshop: Gaps & Challenges (September 8, 2022)
Reports		Conference Presentations
Market Assessment, TechSearch International, Inc.(December 2022)		iNEMI Workshop at International Microwave Symposium: mmWave Permittivity Standard Reference Material Development (June 14, 2023)
System Design Analysis, Florida International University (December 2022)		“5G/6G mmWave Materials and Electrical Test Technology (5G/6G MAESTRO),” Urmi Ray (iNEMI), pre-symposium tutorial on NIST-sponsored roadmaps, IEEE Symposium on Heterogeneous Integration (February 22, 2023; Milpitas, California)
Identification of Next-Generation Dielectric Materials and Testing Needs, Georgia Institute of Technology (December 2022)		iNEMI / MAESTRO Invited Session at iMAPS 19th International Conference & Exhibition on Device Packaging: 5G/6G Roadmap Creation and Packaging Challenges (March 14, 2023; Fountain Hills, Arizona USA)