This initiative is a follow-on to the Pb-Free Alloy Alternatives Project. The project team is now working on the characterization of Pb-free alloy alternatives, with two main thrusts:
The first is to characterize the thermal fatigue and acceleration behavior of alternative alloys through accelerated thermal cycle testing.
The second is to develop a set of test data requirements that will allow OEMs and others to evaluate alloy properties against their requirements.
These requirements and recommended testing methods will be proposed to the IPC Solder Products Value Council to consider for standardization.
Statement of Work
“A Collaborative Consortia Project to Assess the Effect of Thermal Cycling Dwell Time on the Reliability of High-Performance Solder Alloys,” Richard Coyle,PhD, Nokia Bell Labs, SMTA International 2023, Session IRR1: Programs Addressing High Reliability and Mission Critical Applications/Interconnect Research and Reliability (IRR), October 10, 2023; Minneapolis, Minnesota. (Originally published in the proceedings of the SMTA International, October 9 - October 12, 2023)
“Thermal Fatigue Reliability of 1206 Thermal Fatigue Reliability of a 1206 Chip Resistor with High-Performance Pb-Free Solder Alloys,” presented by Timothy Pearson, Collins Aerospace paper presentation
This paper was originally published in the Proceedings of the SMTA International, October 31-November 3, 2022, and received a received a "Best of Proceedings" award from SMTA.
Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony, presented by Richard Coyle, Ph.D. (Nokia Bell Labs), originally published in the Proceedings of SMTA International, September 28 - October 23, 2020.
"Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder Alloys", presented by Richard Coyle (Nokia Bell Labs), SMTA International, September 26, 2019; Rosemont, Illinois.
Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys; presented by Richard Coyle (Nokia Bell Labs), SMTA International, October 18, 2018 (Rosemont, Illinois) NOTE: this presentation was recognized as Best of Proceedings by SMTA.
The Effect of Bismuth, Antimony, or Indi um on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys; presented by Richard Coyle (Nokia Bell Labs), SMTA International, October 18, 2018 (Rosemont, Illinois)
NEMI Pb-Free Alloy Characterization Papers at SMTA 2012 (as originally published in the 2012 SMTA International Conference Proceedings).