The iNEMI Roadmap and Technical Plan emphasize the need for extreme reliability requirements in electronics to meet warranty requirements and mission critical applications. This is especially true for electronic assemblies operating in harsh environments; including high and low extremes of temperature and humidity coupled with vibration.
When new materials are considered, the material suppliers must be able to test those materials against a set of standards and established tests. However, most standards are not written specifically for harsh environment applications, and OEMs often define their own specifications for PCB assemblies.
The purpose of this project is to build on the suite of test procedures proposed in Phase 1 by designing a common test vehicle(s) and demonstrating that the test vehicle, in conjunction with the suite of agreed tests, successfully provides a first-pass verification that a particular material is worthy of consideration for full OEM qualification testing.
Phase 1 of the project focused on automotive OEMs' specifications and requirements. The project team undertook a cross comparison and proposed a simplified sequence of test methodologies that could provide a high probability of a materials suitability for applications in harsh automotive environments.
Phase 2 of the project plans to develop a common test vehicle(s) to accurately reflect typical DUT (device under test) modules, and to validate or develop pass/fail criteria. Additionally, Phase 2 will review standards and test methodology requirements for PCBA materials in other industry sectors that also require high reliability and durability in harsh environments, such as aerospace.
Phase 2 will include:
Please note: iNEMI membership is required to participate in this project sign-up. Initial project sign up ended on October 22, 2018. After that date, please contact Steve Payne. All new sign-ups must be approved by the project team.
For iNEMI members: